Document No.001-82757 Rev. *D
ECN # 4550042
Cypress Semiconductor
Package Qualification Report
QTP# 123401 VERSION*D
October 2014
60 & 70 UFBGA (5.5x5.5x0.6mm)
84 UFBGA (6x6x0.6mm)
SAC105, MSL3, 260C Reflow
ASE-CL (AC)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
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Page 1 of 7
Document No.001-82757 Rev. *D
ECN # 4550042
PACKAGE QUALIFICATION HISTORY
QTP
Number
123401
Description of Qualification Purpose
Qualification of BGA60/84 0.6mm at ASE Chungli(AC) using
DAF ATB125, mold compound KEG1250 and SAC105 lead-free
solder ball at MSL3,260C Reflow Temperature
Date
Sept 2012
Company Confidential
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Page 2 of 7
Document No.001-82757 Rev. *D
ECN # 4550042
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Mold Compound Name/Manufacturer:
BU60A, BU84
60/84 Micro Fine Ball Grid Array (UFBGA) /
5.5x5.5x0.6mm, 6x6x0.6mm
KEG1250/ Kyocera
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index: >28%
54 (typical) / 28 (Min. value)
Lead Frame Designation:
N/A
Lead Frame Material:
N/A
Substrate Material:
BT Resin
Lead Finish, Composition / Thickness:
SAC105
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
SAW Process
Die Attach Supplier:
Henkel
Die Attach Material:
ATB-125, Die Attach Film (DAF)
Bond Diagram Designation
001-78461
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8mil / Au
Thermal Resistance Theta JA C/W:
49.97°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-06099M
Name/Location of Assembly (prime) facility:
ASE-CL(AC)
MSL LEVEL
3
REFLOW PROFILE
260C
Package Outline, Type, or Name:
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA, KYEC
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
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Page 3 of 7
Document No.001-82757 Rev. *D
ECN # 4550042
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Pressure Cooker Test
Temperature Cycle
Acoustic Microscopy
Test Condition (Temp/Bias)
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
Result
P/F
P
P
P
Ball Shear
JESD22-B116, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
Constructional Analysis
Meet external and internal characteristics of Cypress package
P
Die Shear
Per die size:
 <3000 sq. mils = 1.2 kgf
 30001-5000 sq. mils = 1.2 kgf
 >5001 sq. mils = 1.2 kgf
P
Dye Penetrant Test
Test to determine the existence and extent of cracks, Criteria: No
Package Crack
P
Internal Visual
MIL-STD-883-2014
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Solder Ball Shear
JESD22-B117
P
X-Ray
MIL-STD-883 – 2012
P
Company Confidential
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Page 4 of 7
Document No.001-82757 Rev. *D
ECN # 4550042
Reliability Test Data
QTP #: 123401
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
10
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
10
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
10
0
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
10
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
10
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
10
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
5
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
5
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
5
0
STRESS: DYE PENETRATION TEST
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
4
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
4
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
4
0
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
9
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
9
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
9
0
STRESS: DIE SHEAR
STRESS: INTERNAL VISUAL
Company Confidential
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Page 5 of 7
Document No.001-82757 Rev. *D
ECN # 4550042
Reliability Test Data
QTP #: 123401
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
168
80
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
168
74
0
611213415
ASE-AC
OMP
30
0
STRESS: PHYSICAL DIMENSION
CY8CTMA463(8C20406BC)
4147952
STRESS: SOLDER BALL SHEAR
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
1
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
1
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
1
0
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
500
80
0
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
1000
80
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
500
79
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
1000
79
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
500
80
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
1000
80
0
CY8CTMA463(8C20406BC)
4147952
611213415
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213414
ASE-AC
COMP
15
0
CY8CTMA463(8C20406BC)
4147952
611213410
ASE-AC
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-82757 Rev. *D
ECN # 4550042
Document History Page
Document Title:
Document Number:
Rev. ECN
No.
**
3741619
*A
3840157
QTP:123401: 60/70/84 UFBGA (0.6MM) SAC105, MSL3, 260C REFLOW, ASE-CL (AC)
001-82757
Orig. of
Change
ILZ
NSR
*B
3934322 ILZ
*C
4239665 JYF
*D
4550042 HSTO
Description of Change
Initial spec release
Corrected the package code from VFGA to UFBGA in the spec title,
title page and major package information table.
Corrected mold compound supplier from Sumitomo to Kyocera and
added prefix ”KE” on page 3 - “Major Package Information Used In
This Qualification Table”
Updated package size of 60 UFBGA from 5x5x0.6mm to
5.5x5.5x0.6mm and added 70 UFBGA package in QTP title page;
Added 5.5x5.5x0.6mm package dimension in Major Package
Information table.
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
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Page 7 of 7