LQFN Package
28-Lead (5mm × 4mm × 0.94mm)
28×
ddd Z
(Reference LTC DWG # 05-08-1579 Rev Ø)
2×
DETAIL A
A
aaa Z
ccc M Z X Y
23
PAD “A1”
CORNER
28
1
22
5
Z
A1
DETAIL C
PIN 1 NOTCH
0.20 × 45°
0.20
b
1.20
0.20
0.25
E1
E
SEE NOTES
SUBSTRATE
e
DETAIL C
aaa Z
15
14
DETAIL B
PACKAGE TOP VIEW
e/2
e
2×
28b
eee M Z X Y
fff M Z
D1
9
7
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
L
1.2500
0.7500
0.2500
0.0000
0.2500
0.7500
1.2500
e
b
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. PRIMARY DATUM -Z- IS SEATING PLANE
DIMENSIONS
0.375
0.25 ±0.05
0.375
1.7500
1.2500
0.20
0.375
DETAIL B
DETAIL A
PACKAGE
OUTLINE
8
Z
// bbb Z
Y
X
D
0.80
6
H1
H2
4
1.25
ccc M Z X Y
MOLD
CAP
1.20
0.7500
0.2500
0.0000
0.2500
5.50 ±0.05
0.20
0.7500
1.25
1.2500
0.70 ±0.05
1.7500
4.50 ±0.05
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
L
b
D
E
D1
E1
e
H1
H2
aaa
bbb
ccc
ddd
eee
fff
MIN
0.85
0.01
0.30
0.22
NOM
0.94
0.02
0.40
0.25
4.00
5.00
2.70
2.60
0.50
0.24
0.70
MAX
1.03
0.03
0.50
0.28
NOTES
4
METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN
SO AS NOT TO OBSCURE THESE TERMINALS AND HEAT FEATURES
5
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER
MAY BE EITHER A MOLD OR MARKED FEATURE
6
THE EXPOSED HEAT FEATURE IS SEGMENTED AND ARRANGED
IN A MATRIX FORMAT. IT MAY HAVE OPTIONAL CORNER RADII
ON EACH SEGMENT
7
CORNER SUPPORT PAD CHAMFER IS OPTIONAL
SUBSTRATE THK
MOLD CAP HT
0.10
0.10
0.10
0.10
0.15
0.08
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LQFN 28 0417 REV Ø