LGA Package 18-Lead (3mm × 3mm × 0.94mm) (Reference LTC

LGA Package
18-Lead (3mm × 3mm × 0.94mm)
ddd Z
(Reference LTC DWG # 05-08-1548 Rev A)
18×
2×
DETAIL A
aaa Z
ccc M Z X Y
A
15
SEE NOTES
8
18
PIN 1 NOTCH
0.25 × 45°
1
14
PAD “A1”
CORNER
e
4
0.440
F
A1
b
D1
6
0.250
Z
0.250
DETAIL C
SEE NOTES
0.250
3
10
5
SUBSTRATE
MOLD
CAP
X
DETAIL B
18b
eee M Z X Y
fff M Z
Z
// bbb Z
e/2
e
0.7500
0.2500
0.0000
0.2500
DIMENSIONS
0.7500
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
PACKAGE
OUTLINE
0.25 ±0.05
1.0000
0.5000
0.0000
0.5000
0.70 ±0.05
1.0000
3.50 ±0.05
6
PACKAGE BOTTOM VIEW
DETAIL B
SUGGESTED PCB LAYOUT
TOP VIEW
e
G
H1
H2
3.50 ±0.05
b
E1
PACKAGE TOP VIEW
2×
aaa Z
9
DETAIL C
Y
E
ccc M Z X Y
D
SYMBOL
A
A1
b
D
E
e
F
G
D1
E1
H1
H2
aaa
bbb
ccc
ddd
eee
fff
MIN
0.85
0.01
0.22
0.20
0.65
NOM
0.94
0.02
0.25
3.00
3.00
0.50
2.00
1.50
1.50
1.70
0.24
0.70
MAX
1.03
0.03
0.28
0.40
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN
SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER
MAY BE EITHER A MOLD OR MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6
THE EXPOSED HEAT FEATURE MAY HAVE OPTIONAL CORNER RADII
7
CORNER SUPPORT PAD CHAMFER IS OPTIONAL
8
0.28
0.75
0.10
0.10
0.08
0.10
0.15
0.08
TOTAL NUMBER OF LGA PADS: 18
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTXXXXXX
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 18 1216 REV A