TECHNICAL PRODUCT INFORMATION
OIR™ 906
Fast high performance photoresist
Resolution
Thickness
1.20 µm
i-line Performance
0.40 µm
Focus
Latitude
0.40 µm l/s
-0.60 µm
- Robust, fast i-line photoresist for > 0.4 µm CD production with
proven performance on all device layers.
- High Performance resist in g-line with resolution to <0.6µm.
- Excellent process latitude makes this resist a strong performer in Fabs
undergoing conversion from g- to i-line and the resist of choice for the
non-critical applications in high resolution i-line and DUV processes.
-0.40 µm
0.37 µm
- Dyed versions use Fujifilm’s speed enhancing dye technology.
- Optimized for processing with 0.262N surfactant-free and
surfactant-containing developers.
-0.20 µm
0.35 µm
OiR906-17MD
Resist Thickness
1.7µm
Product Features:
0.00 µm
- Fast i-line resist: production capable down to 0.45µm
- Wide Process Latitude for i-line, g-line, and broadband exposure
- Thermal Stability > 120°C
0.50 µm L/S
@ 185mJ/cm2
- Vertical Profiles
0.20 µm
- Compatible with bottom ARCs
OiR906-17HD
Resist Thickness
1.7µm
- Compatible with TiN
- Excellent Wide Field Stepper performance
0.40 µm
- Fast dyed versions
- Filtered to 0.2µm
- Compatible with O2 Plasma stripping and Fujifilm’s line of Microstrip
wet strippers and side wall polymer removers.
0.50 µm L/S
@ 210mJ/cm2
0.60 µm
E1:1:
Substrate:
Resist Thickness:
Soft Bake:
Exposure Tool:
150mJ/cm2
Silicon
1.20µm;
90°C/60"
Canon FPA-3000i4
NA=0.52 i-line
Post Exposure Bake: 120°C/60"
Developer:
OPD 262
60” single puddle
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Exposure Latitude
Exposure Latitude
CD
0.4µm l/s
0.5µm l/s
E1:1
150mJ/cm2
150mJ/cm2
Exp.Lat.
16%
23%
OiR 906-12
Dose Latitude
0.60
0.50µm L/S EL=23%
Substrate:
Resist Thickness:
Soft Bake:
Exposure Tool:
Silicon
1.20µm
90°C/60"
Canon FPA-3000i4
NA=0.52 i-line
Post Exposure Bake: 120°C/60"
Developer:
OPD 262
60” single puddle
0.40µm :L/s EL=16.5%
Measured CD (µm)
0.55
0.50
0.45
0.40
0.35
0.30
120
130
140
150
160
170
180
190
2
Dose (mJ/cm )
Contact Hole Resolution
250mJ/cm2
Film Thickness vs. Spin Speed
2.8
2.6
Refractive Index
(633nm) = 1.6139
2.4
HB: None
Cauchy Coefficients
0.45 µm
0.40 µm
HB: 125 °C
Substrate:
Resist Thickness:
Soft Bake:
Exposure Tool:
Silicon
1.262 µm
90°C/60"
Canon FPA-3000i4
NA=0.63 σ= 0.50 i-line
Post
Exposure
HB: 130
°C Bake: 120°C/60"
Developer:
OPD 262
60” single puddle
The data contained in this technical bulletin is believed to be
true and accurate, but is offered solely for your consideration,
investigation, and verification. Nothing herein shall be
construed to be a warranty or guarantee by the Fujifilm
Electronic Materials manufacturer (“FFEM”) or any of its
affiliates, and all such warranties, implied or otherwise, including
any express or implied warranty of merchantability or fitness for
a particular purpose, are hereby expressly disclaimed. You are
fully responsible for any use and/or domestic or foreign sales of
the product(s) described. Nothing in this technical bulletin shall
be construed to constitute permission or a recommendation to
use or practice any invention covered by a patent or patent
application or know-how owned by FFEM, its affiliates, or
others.
Please refer to the material safety data sheet (MSDS) for
complete information on storage and handling, toxicological
properties, personal protective equipment, first aid, spill and
leak procedures, and waste disposal. To order an MSDS, call
your FFEM sales office. Before using or handling this product,
review the MSDS information thoroughly.
www.fujifilm-ffem.com
Film Thickness (µm)
2.2
n 1 = 1.5815
2.0
n 2 = 1.298 10
6
1.8
n 3 = 1.813 10
10
1.6
1.4
1.2
1.0
OiR 906 10i
0.8
OiR 906 12i
0.6
OiR 906 17i
0.4
2000
3000
4000
5000
Spin speed (rpm/s)
6000
European Headquarters
Fujifilm Electronic Materials
(Europe) N.V.
Keetberglaan 1A
Havennummer 1061
B-2070 Zwijndrecht
Belgium
Telephone : 32-3-250-0511
Fax :
32-3-252-4631
Worldwide Headquarters
Fujifilm Electronic Materials, Co., Ltd.
4000 Kawashiri
Yoshida-Cho
Haibara-Gun
Shizuoka 421-0302
Japan
Telephone : 81-548-32-7007
Fax :
81-548-33-2761
Fujifilm Electronic Materials
U.S.A., Inc.
6550 South Mountain Road
Mesa, Arizona 85212
U.S.A
Telephone : 1-480-987-7536
1-480-987-6546
Fax :
1-480-987-7104
Fujifilm Electronic Materials U.S.A., Inc.
Quonset Point
80 Circuit Drive
North Kingstown, Rhode Island 02852
U.S.A.
Telephone : 1-800-553-6546
FCD-1360 Rev 001
TECHNICAL PRODUCT INFORMATION
OiR 906 Series
• OiR 906series is a 0.4µm fast i-line photoresist with high performance
in g-line and wide process latitude
• OiR 906 employs sophisticated capped Novolak technology and is
cast is EEP/MMP solvent
• OiR 906 is compatible with BARC’s and TiN substrates and comes in
dyed versions with fast photospeed
• i-line performance
•Resolution < 0.37µm
0.5µm L/S
DOF > 1.8µm for
•Photospeed: 100 - 120mJ/cm2
0.5µm L/S
EL > 30% for
• g-line performance
•Resolution < 0.6µm
0.8µm L/S
DOF > 3.0µm for
•Photospeed: 130 - 150mJ/cm2
0.8µm L/S
EL > 30% for
Technical Data
Solids (%) Min.
Solids (%) Max.
Viscosity (cst) Min.
Viscosity (cst) Max
Water Content
Filtration
Refractive Index
Flash Point
Trace Metals
OiR 906-10 OiR 906-12 OiR 906-17
25.5
27.5
31
27.5
29.5
33
9
14
26.7
15
20
32.7
<0.5%
0.2 micron (absolute)
1.67
53°C (closed cup)
None > 30 ppb
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OiR 906-17 i-Line Resist
Film Thickness vs. Spin Speed Curve
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OiR 906-17 Spin Curve
Film Thickness vs. Spin Speed Curve
Film Thickness (Å)
34,000
29,000
24,000
19,000
14,000
0
1000
2000
3000
4000
5000
6000
Spin Speed (RPM)
• on 200 mm silicon wafers; DNS 80B Track
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This document and the information contained herein are offered solely for your consideration, investigation and verification. NO REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, OF
MERCHANTABILITY OR OTHERWISE, ARE MADE OR CONTAINED HEREIN. FUJIFILM Electronic Materials exclusive responsibility for any claims, including claims based on negligence, arising in connection with
the information contained herein or the subsequent purchase, use, storage or handling of the product will in no event exceed FUJIFILM Electronic Materials sales price for the product with respect to which damages
are claimed. IN NO EVENT WILL FUJIFILM Electronic Materials BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. User accepts full responsibility for compliance with all applicable Federal,
state and local laws and regulations. Nothing contained herein will be construed to constitute permission or a recommendation to use the product in any process or formulation covered by a patent or a patent
application owned by FUJIFILM Electronic Materials or by others. No statements or representations which differ from the above shall be binding upon FUJIFILM Electronic Materials unless contained in a duly
executed written agreement.. These commodities, technology or software were exported from the United States in accordance with the Export Administration Regulations. Diversion contrary to U.S. law is prohibited.
© 2005 FUJIFILM Electronic Materials U.S.A., Inc.
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