256 - BGA ( 27 x 27 mm )
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BJ
B1: 4000.6451 mg
B2: 4372.3423 mg
Body Size (mil/mm)
Package Weight – Site 2
27 x 27 mm
N/A
SUMMARY
The 256- BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 044507, 113003 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BJ256ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04983 Rev. *H
Page 1 of 5
256 - BGA ( 27 x 27 mm )
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance
per
Homogenous
Material
PPM
% Weight of
Substance
per
Package
HS Cu
7440-50-8
2448.0929
70.8100%
611,925
61.1925%
HS Ni
7440-02-0
23.8552
0.6900%
5,963
0.5963%
SM Epoxy
Epoxy Resin
Glass
Cu
Ni
Au
Sn
Ag
Cu
Ag
Bismaleimide
Methacrylate
Acrylate
Polymer
Si
Au
Silica Fused
Epoxy Resin
Anhydride
Carbon Black
Additives
29690-82-2
Trade Secret
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
25550-51-0
1333-86-4
Trade Secret
62.5766
383.4112
196.7187
338.4667
3.4573
0.3457
272.4329
11.4108
1.4264
6.4002
0.7999
0.7999
0.4004
0.4004
58.0100
8.0000
136.0221
28.4091
18.4007
0.4040
0.4040
1.8100%
11.0900%
5.6900%
9.7900%
0.1000%
0.0100%
95.5000%
4.0000%
0.5000%
72.7300%
9.0900%
9.0900%
4.5500%
4.5500%
100.0000%
100.0000%
74.0700%
15.4700%
10.0200%
0.2200%
0.2200%
15,642
95,837
49,172
84,603
864
86
68,097
2,852
357
1,600
200
200
100
100
14,500
2,000
34,000
7,101
4,599
101
101
1.5642%
9.5837%
4.9172%
8.4603%
0.0864%
0.0086%
6.8097%
0.2852%
0.0357%
0.1600%
0.0200%
0.0200%
0.0100%
0.0100%
1.4500%
0.2000%
3.4000%
0.7101%
0.4599%
0.0101%
0.0101%
Package Weight (mg):
4000.6451
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04983 Rev. *H
Page 2 of 5
256 - BGA ( 27 x 27 mm )
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Material
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
(Dam)
Mold
Compound
(Fill)
Substance
Composition
CAS
Number
Weight by
mg
SM Epoxy
Au
Ni
Cu
Epoxy Resin
Glass
HS Cu
HS Ni
Sn
Ag
Cu
Acrylic Resin
Polybutadiene
Butadiene
Copolymer
Acrylate
Peroxide
Additive
Silver
Si
Au
Ion Impurities
Diglycidylether
Trade secret 0105
substituted
phthalic anhydride
substituted
phthalic anhydride
Cycloaliphatic
Epoxy Resin
BispenolA epoxy
resin
Carbon black
Cristobalite
Silica vitreous
Hexahydromethyl
phthalic
Silicon dioxide
29690-82-2
7440-57-5
7440-02-0
7440-50-8
Trade Secret
60676-86-0
7440-50-8
7440-02-0
7440-31-5
7440-22-4
7440-50-8
Trade secret
Trade secret
69.5966
0.0387
3.8665
378.9149
429.1791
220.3893
2733.6005
27.0654
257.2816
10.7762
1.3470
0.0056
0.5577
% Weight of
Substance
per
Homogenous
Material
1.8018%
0.0010%
0.1001%
9.8097%
11.1110%
5.7056%
70.7701%
0.7007%
95.5000%
4.0000%
0.5000%
0.1326%
13.2567%
Trade secret
0.1859
Trade secret
Trade secret
Trade secret
7440-22-4
7440-21-3
7440-57-5
Trade Secret
1675-54-3
Trade Secret
Purpose of
Use
Encapsulation
Encapsulation
Oxirane
Epoxy Resin
Resin
Quartz(Sio2)
Carbon Black
25550-51-0
1.5917%
0.0009%
0.0884%
8.6662%
9.8158%
5.0405%
62.5203%
0.6190%
5.8843%
0.2465%
0.0308%
0.0000%
0.0128%
4.4189%
43
0.0043%
0.3718
0.0372
0.0744
2.9743
47.1721
9.6623
0.0010
0.1400
0.1400
8.8378%
0.8838%
1.7676%
70.7026%
100.0000%
99.9900%
0.0100%
3.7397%
3.7397%
85
9
17
680
10789
2210
0
32
32
0.0085%
0.0009%
0.0017%
0.0680%
1.0789%
0.2210%
0.0000%
0.0032%
0.0032%
0.8402
22.4383%
192
0.0192%
0.1400
3.7397%
32
0.0032%
0.1400
3.7397%
32
0.0032%
0.1400
1.1370
1.0670
66.6900
3.7397%
30.3665%
28.4966%
38.0000%
32
0.0032%
260
244
15253
0.0260%
0.0244%
1.5253%
52.6500
17.5500
17.5500
8.7750
8.7750
1.7550
1.7550
30.0000%
10.0000%
10.0000%
5.0000%
5.0000%
1.0000%
1.0000%
12042
1.2042%
4014
4014
2007
2007
401
401
0.4014%
0.4014%
0.2007%
0.2007%
0.0401%
0.0401%
2386-87-0
25068-38-6
25550-51-0
7631-86-9
27610-48-6
Trade Secret
Trade Secret
14808-60-7
1333-86-4
PPM
15917
9
884
86662
98158
50405
625203
6190
58843
2465
308
0
128
34090-76-1
1333-86-4
14464-46-1
60676-86-0
% Weight of
Substance
per
Package
Package Weight (mg): 4372.3423
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04983 Rev. *H
Page 3 of 5
256 - BGA ( 27 x 27 mm )
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
< 2.0
< 2.0
< 5.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
<2.0
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE
PPM
< 2.0
< 2.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
< 2.0
< 50.00
< 50.00
<50.0
< 0.0005
< 45.00
< 45.00
<45.0
< 0.0005
<2.0
<2.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04983 Rev. *H
Page 4 of 5
256 - BGA ( 27 x 27 mm )
Pb-Free Package
Document History Page
Document Title:
Document Number:
256-BGA 27X27MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04983
Orig. of
Change
GFJ
Rev.
ECN No.
**
399136
*A
2581994 JARG
*B
2760908 HLR
3368656 HLR
*C
*D
3359970 EBZ
*E
4031214 YUM
*F
4098921 YUM
HLR
*G
4950972
*H
5471949
DCON
HLR
Description of Change
New document
Added column for %weight of substance per homogeneous
material in material composition.
Updated and added Lead, Cr+VI, PBB and PBDE on the
Declaration of Packaging/Indirect Materials table
Change CAS number for Au in material composition table
Updated Cypress Logo.
Changed the ball composition on the material composition table.
Updated the material composition table to reflect 4 decimal
places on values.
Added package weight B2 for Site 1. Added Package
Qualification Report #1113003 for site 1. Added Material
Composition table B2 for Site-1.
Added the Assembly Site Name in the Assembly heading.
Changed the assembly code to Assembly Site Name.
Removed entire Tube row in the Indirect Materials section.
Corrected total package weight in site 1:B1 from “4000.6542” to
“4000.6541”.
Changed the substances with “-------------“to “Trade Secret”.
Removed Distribution and Posting from the document history
page.
Changed Cypress Logo.
Changed the substances with Proprietary to “Trade Secret".
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04983 Rev. *H
Page 5 of 5