UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
Getting the most out of your Diamond Sectioning / Wafering Operation
Cross Sectioning is the first and most important step in the sample
New improvements in diamond wafering blade manufacturing
preparation process. Getting the best results involves obtaining a
technology have expanded the use of diamond, into many other
smooth surface finish, minimum chipping, material deformation,
application, traditionally sectioned by other types of cut off blades.
without sacrificing cutting speed. Today, most laboratories, work with
dozens of materials. Frequently each material requires a different sectioning
method and sample preparation approach. Selecting the right equipment,
consumables, and parameters for your specific material/application will
significantly affect your sectioning operation. Save you time and money, as
well as set the stage for the rest of your specimen preparation process.
The ever increasing variety of ultra hard, new generation, composite,
engineered, highly metallic content and exotic materials, transform
the way we look at cross sectioning. And set many age old
Historically Laboratories, R & D, and manufacturing facilities have
found the high cost of using diamond wafering blades prohibitive.
Relying on abrasive cut off blades to observe brunt of their
sectioning work, including application where use of diamond could
be advantages. Diamond can be used to section very hard
materials, than switch to cutting soft materials, while still maintain
consistent performance and cutting speed. SMART CUT
technology recently developed by UKAM Industrial Superhard Tools
has made use of diamond wafering blades more economically
feasible on broader variety of materials & applications. Materials
such as:
conventional sectioning equipment and consumables obsolete. New
materials require different technology & sample preparation methods.
•
Plastic
•
Very soft metals
With sectioning/wafering saw manufacturers recommending a different blade
•
Non-ferrous soft metals
for each material. Abrasive blades for some materials, such as: ductile
•
Very ductile metals
metals, such as sintered carbides or composites containing predominantly
•
(Ti) Soft ferrous metals
hard phases. Sintered (metal bonded) diamond wafering blades for cutting of
•
Medium soft ferrous metals
•
Medium hard ferrous metals Hard ferrous metals
•
Very hard ferrous metals
brittle materials, such as ceramics or minerals. CBN (cubic boron nitride, and
Resin bond diamond wafering blades for cutting highly metallic materials.
Many laboratory technicians still spend days and even weeks,
•
Extremely hard ferrous metals
experimenting with different consumables, cut off wheels, coolants,
•
Sintered carbides
RPM’s and many other variables. An expensive and time consuming
•
Hard ceramics
trial and error process, witch can be avoided with proper
•
Minerals and ceramics
understanding of your material, consumables and objectives you
need to accomplish.
Have been successfully sectioned utilizing new generation metal
bond diamond wafering blades with SMART CUT technology.
New Generation diamond wafering blades have been engineered to
change they way sectioning and specimen preparation process is
handled. This article deals with new developments in diamond wafering
How Diamond Wafering Blades Work
Simply, a diamond blade wafering blade is a cutting tool which has
blade manufacturing, technologies and several misconceptions regarding
exposed diamond particles captured in a metal matrix each with a
their use. The following information have come from years of experience in
small cutting edge. 1A1R wafering blade is made of a steel core with
research, development and manufacturing of precision diamond products, as
an Inside Diameter (ID) usually ½” or other size, that rotates around
well as years of personal experience and observation.
a center shaft.
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
During the sectioning operation, the surface speed may reach 30
remove more material than finer diamond particles. This
m/sec, if using a high speed sectioning saw. This is faster than most
means that coarse diamond wheels are more aggressive
cars running on a highway. The cutting action is performed by
for material removal than the finer diamond wheels and will
accumulation of small chips scratched out by the numerous diamond
cut faster. However, the tradeoff is increase in material
particles impeded in the bond.
micro damage. If you are cutting fragile, more delicate
materials then finer mesh size diamond wafering blades are
The number of cutting edges which is determined by the number
recommended.
of diamonds (or concentration) make up the structure of the
diamond blade, along with its matrix, (metal or nickel bond). The
Diamond mesh size (grit size) should provide maximum
size of the diamond particle will have a direct result in the size
removal rate at minimal acceptable finish. Often the desired
of chip you can obtain. The thickness of the blade (diamond
finish cannot be achieved in a single step/operation.
particle plus matrix) will determine the width of the cut. Therefore,
Lapping or polishing may be necessary to produce desired
blade selection along with feed rate, cutting speed, and depth of
surface finish, as a secondary step in your sample
cut will ultimately determine your sectioning success.
preparation process.
The following are some factors to consider when selecting the right
diamond wafering/sectioning blade for your application:
Diamond Grit (Mesh Size)
According to U.S. Standards, mesh designates the approximate number
of sieve meshes per inch. High Mesh Sizes mean fine grits, and low
numbers indicate coarse grits.
Diamond Mesh Size plays a major role in determining the surface finish
quality, smoothness, level of chipping you will obtain, and material
microstructure damage you will obtain. Finer mesh size diamonds such
as 220 and 320 grit are much smaller in size than coarser diamond
particles. And will give you a very smooth surface finish, with minimal
amount of chipping on edges. These mesh sizes are usually used for
fine cutting of a full rage of materials such as: LiNbO3, YVO4, GaAs,
and optical materials. Courser diamond particles such as 80 and 100
grit are much larger in diameter and are frequently used fast cutting /
material removal on more harder materials such as silicon carbide,
zirconia, Al2O3, stainless steels, and other advanced ceramics and
high metallic content materials. Witch do not require a very fine surface
finish.
Diamond Mesh size does have considerable effect on cutting speed.
Coarse Diamonds are larger than finer diamonds and will
Diamond Wafering Blades & Cutting Speeds
High Speed vs. Low Speed
Sectioning can be performed either at low or high speeds.
There are advantages and disadvantages of each process.
Diamond may break at very high speeds, and fall out at
very slow speeds. An optimum surface speed / RPM’s must
be selected to balance out the two disadvantages.
Diamond Wafering Blade life will usually increase at slower
cutting speeds. However the increase in labor costs, utilities
costs, depreciation of equipment and other overhead
expenses. Will usually offset the saving blade life and other
consumables. Cutting speed is often the most important
consideration when selecting the right diamond wafering
blade for your application. The operator mush choose a
balance between life of the blades and their cutting rate.
Diamond has a higher impact strength than the material
being machined. During the sawing operation, the diamond
ruptures the material by impact. Each diamond is able to
transfer the electrical power into momentum the breaks the
material.
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
By increasing power on your sectioning saw, your diamond wafering
Each diamond wheel was used to make three cuts on
blade RPM’s and surface speed will increase as well. Hence, each
each sample, with a total of nine cuts total
diamond will chip off a smaller amount of material, reducing its impact
per wheel. The diamond wheels were dressed with a
force on material being machined. And reducing cutting resistance. In
silicon carbide dressing stick immediately
theory, by increasing surface speed / RPM’s, each diamond should
prior to cutting. The following cutting parameters were
receive a smaller impact force.
used for each of the cuts made.
However, because impact is supported by a smaller volume, the impact
Cutting Parameters
force with this low volume is actually increased. There is a higher
probability that the diamond particles will break or shatter. Hence,
Load: 80 grams Blade Dressing: Prior to each cut
sectioning materials at very low surface speeds, creates a large impact
Wheel Speed: 10 maximum on dial)
force between diamond and material being machined. Although the
diamond may not break, the risk that the diamond will be pulled out of
Coolant Density: 30:1
diamond wafering blade and causing premature failure of the blade
does increase.
Diamond Wafering Blades & Cutting Speeds Case Studies
New Generation Sintered (metal bond) diamond wheel with SMART
CUT technology was tested against a conventional metal bond
diamond wheel under similar conditions. Using three different materials,
namely Aluminum, Brass, and Quartz, cuts were made to determine
cutting times for all five diamond wheel types. Using a Model 650 Low
Speed Diamond Wheel Saw, each diamond wheel blade was used for
Each cut was timed and recorded, with each cut
averaged for each sample and then plotted in a
graph.
Results: New Generation, Sintered (metal bonded)
Diamond Wafering Blades with SMART CUT
technology cut substantially faster than Conventional
Sintered (metal bond) diamond wafering
blades. For all three materials.
cutting the specified materials. Each specimen cut was a 12-millimeter
Cutting Times of Various Materials Using Different
diameter rod of material, helping maintain consistency during the cutting
Diamond Wheels
process. Specimens were first mounted onto a graphite plate, which
(All samples 12mm rods)
was then mounted onto an aluminum mounting block. The entire
system was then placed into the Model 65001 Single Axis Goniometer
New Generation Metal Bond
specimen mount of the Model 650. Specimens were mounted using
Diamond Wafering Blades
MWH 135 low melting point wax (melting point at 100 degrees Celsius).
with SMART CUT technology
Conventional Metal Bond
Diamond Wafering Blades
The following diamond wheels were used in this experiment:
Material
Conventional Diamond Wafering Blade, Sintered (metal bonded) 4.
diameter; 0.012. thickness; Mesh Size: coarse; Diamond Concentration:
Quartz
4.5 minutes
10 minutes
High
Aluminum 26 minutes
29.5 minutes
Brass
33.5 minutes
New Generation, Sintered (metal bonded) Diamond Wafering Blade
with SMART CUT technology. 4. diameter; 0.012. thickness; Mesh
Size: coarse Diamond Concentration: High
25.5 minutes
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
Diamond Concentration
for sectioning ceramics, glasses, silicon, carbides,
sapphire, and other related semiconductor and optical
The proportion, and distribution of diamond abrasive particles, also
materials. And use high concentration wafering blades
known as “concentration” has an effect on overall cutting
should on metals such as stainless steel, aluminum,
performance and price of precision diamond blades. Usually
titanium, pc boards. A new technological breakthrough
concentration defined as: Concentration 100 = 4.4 ct per cm layer
called SMART CUT technology, in orienting diamonds
volume (mesh size + bond).
inside the metal matrix, so that every diamond is better
able to participate in cutting action, is making
Based on this definition a concentration of 100 means that the
fundamental changes in these beliefs and setting new
diamond proportion is 25% by volume of diamond layer, assuming at
benchmarks on how diamond wafering blade
diamond density is 3.52 g/cm3 and 1 ct = 0.2g. Nominal diamond
performance is measured.
concentration in precision diamond blades range from 0.5 ct/cm3 to 6
ct/cm3. This means diamond concentrations are available from 8 to
By orienting diamonds, SMART CUT technology makes
diamond concentration only a minor factor in the overall
135).
sectioning equation. Studies and extensive testing shows
Until recently Diamond Concentration has played a major role in
that diamond concentration in wafering blades
Diamond Sectioning/Wafering Blade performance. A new
manufactured utilizing SMART CUT technology plays a
technological process recently developed, called SMART CUT
no major role in determining overall wafering
technology, minimizes the effect of diamond concentration in your
performance. Large number of diamonds in a high
overall sectioning process. Selecting Optimum Diamond
concentration diamond wafeirng blade come in contact
Concentration for your application will depend on a large number of
with material, creating friction, hence considerably
factors, such as:
slowing down material removal rate. It takes considerable
dressing in order to rexpose the next diamond layer.
•
Material Being Cut
•
Bond Type and Hardness
SMART CUT technology resolves this problem by
•
Diamond Mesh Size
making sure that every diamond is in the right place and
•
Cutting Speeds
at the right time, working where you need it most. You get
•
Coolants being used
maximum use of diamond and bond. Before this
technology was developed, orienting diamonds inside the
Diamond Concentration is still a factor in determining the life and
wafering blade bond matrix was impossible. This was one
cutting speed of your Diamond Sectioning/Wafering Blade. Higher
of the main problems faced by diamond tool
diamond concentration is recommended and usually used for cutting
manufacturers worldwide. Over the decades there have
softer and more abrasive types of materials. However, the trade off is
been numerous attempts to solve the diamond and CBN
significantly slower cutting speed. Low diamond concentration is
distribution problem. Unfortunately, none of the attempts
recommended and widely used for cutting ultra hard and brittle
have been proven effective. Even today 99.8% diamond
materials.
wafering blade manufacturers still have no way or
technology to evenly control and distribute Diamond or
Diamond Concentration & Cutting Performance
Today, most sectioning saw manufacturers and laboratory technicians
recommend and use low concentration diamond wafering
CBN particles inside bond matrix, nor properly position
them to maximize their machining efficiency.
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
Current Diamond Wafeirng Blade technologies are also inadequate to
If diamond particles are separated too far (the impact
provide effective control of diamond mesh size (grit size) and
exerted by each diamond particle on material becomes
concentration of variations on different parts of the same tool. Current
excessive). The sparsely distributed diamond or CBN
technologies also do not allow diamond distribution to be factored in
particles may be crushed or even dislodged from the matrix
when manufacture a wheel specifically designed for individual material
into which they are disposed. The damaged or missing
property and structure.
diamond particles are unable to fully assist in the work load.
Hence the workload is transferred on to the remaining
What most diamond wafering blade manufacturers used to do, and
diamond particles. The failure of each diamond particle
still do today is place diamonds
causes a chain reaction, witch soon results in tool
inside the metal matrix, with no
control over diamond distribution. The problem with this approach
ineffective performance or complete pre-mature failure of
is inconsistent diamond tool performance. Only about 40% of these
the wafering blade.
diamonds are able to participate in the cutting action. The rest fall
out, become dull, or disintegrate before they have a chance of
Inconsistent Cutting Speed & Excessive Blade
being used. This factor causes the following problems:
Dressing
Problems with Conventional Diamond Wafering Blades
Conventional diamond wafeirng blade usually exhibit the
following behavior: After a few dozen cuts, speed of the
The distance between each Diamond or CBN particles determines the
wafering blade gradually begins to slow down. You will
work load each diamond will perform. Improper spacing of diamond or
notice excessively longer cutting speeds, and equipment
CBN particles typically leads to premature failure of abrasive surfaces
motor bug downs. And since only a few diamonds
or structure. If diamond or CBN particles are too close to one another,
participate in the machining action, you may find your
some of these particles are redundant and provide little or no
self applying an increasing amount pressure just to
assistance in cutting and sectioning. Excess diamonds particles
machine the same amount of material. Without properly
increase the cost of manufacturing diamond tools, due to high cost
orienting the diamonds, conventional wafering blades
diamond and CBN powder.
quickly become dull, out of round. With further cutting
requiring constant blade dressing, in order to expose
Yet have no effect in increasing performance. In fact excess and non
new diamonds.
performing diamond or CBN particles reduce the diamond tools overall
performance and efficiency by blocking up the passage of debris from
Excessive Heat Generation & Loss of straight cutting
material being machined. In many cases these excessive diamond
capability
particles play a major rule in decreasing the useful life of your diamond
tool. Conventional diamond wafering blades and diamond tools have
By constantly dressing the wafering blade, pressure put
been suffering from these type of problems and inefficiencies for over
forth on material, causes the tool to overheat and loose its
50 years.
tension. The user may find themselves using excessive
force and pressure just to cut a small amount of material.
Diamond Inefficiency / Ineffective Wafering Blade
Performance
SMART CUT technology allows
Diamond Concentration to be controlled
The performance of a diamond wafering blade depends on how
diamonds are distributed and adhered in matrix. Diamond weak.
& Evenly Distribution at various parts of
diamond wafering blade
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
Frequently a metal bond diamond wafering blade requires different
sizes of diamonds and different diamond concentrations to be
distributed at different parts of the wafering blade bond. Most diamond
wafering blades wear faster on the edge or in front than the middle.
Higher diamond concentrations are preferred in these locations to
prevent uneven wear and thus premature blade failure.
By making the distribution of Diamond or CBN particles uniform and in a
predetermined pattern, tailored to individual customer application. The
work load can be evenly distributed to each diamond particle. As a
result a diamond wafering blade with SMART CUT technology will
machine material faster and its working life will be extended a
considerable amount of time.
SMART CUT technology promotes not only even diamond
distribution. But strong diamond retention as well. Allowing the diamond
wafering manufacturer to use of smaller diamond particles. Small
diamond particles will improve surface finish, and optimized
performance of each diamond particle.
How SMART CUT works
Figure # 1
The sharpest and finest quality Synthetic DeBeers diamonds that go
into a SMART CUT™ Diamond Bond. Immediately penetrate into the
material , grinding and polishing as they cut.
Figure # 2
Diamonds are activated only at the exposed layer. As diamond layer
begins to wear out, diamonds in the new layer are immediately
activated, substituting the already used up diamond layer. The SMART
CUT™ Diamond Bond makes sure every diamond is in the right place
and at the right time, working where you need it most.
Figure # 3
The newly exposed diamonds don’t effect diamonds working already
inside the material. Unlike many other diamond bonds, diamond in a
SMART CUT™ remain sharp and grow sharper with each cut.
Prolonging product life and consistent performance.
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
sectioning results obtained using the New Generation
Figure # 4
This advanced formulated open bond design insures minimal
chipping, fast cut, constant speed of cut, minimal cutting noise,
Sintered (metal bond) diamond wafering blade.
New Generation Metal
Bond with SMART CUT
technology
Conventional Metal Bond
Diamonds are oriented
and evenly distributed
through the bond. So that
every diamond is better
able to participate in
cutting action.
Diamonds are placed
inside bond with no control
over diamond distribution
or orientation. 100
concentration is used to
make sure the blade will
cut hard materials.
Microstructure of New
Generation Metal Bond
with SMART CUT
technology
Microstructure of
Conventional Metal Bond
Wafering Blade
and most important of all minimum loss of precious material.
ADVANTAGES:
SMART CUT technology allows the diamond spacing to be
controlled in the wafering blade bond matrix. Hence improving
every diamond particles performance. Often reducing the need
for high diamond concentration, such as 100 con used in wafering
blades. Every Diamond in a SMART CUT diamond bond
works like a small horse. Unlike many other bond designs,
the SMART CUT begins to work from the first cut, and
remains to work at the same level of consistent performance
until you take your last cut. This unique open bond
design insures you get the maximum usage of diamond and
bond every time you use a SMART CUT wafering blade.
•
More Consistent cutting speeds
•
Minimal Chipping
•
Faster Cutting Action
•
Minimal Blade Dressing / Diamond Rexposure
•
Easier to Use / Less maintenance required
Diamond concentration
Some areas of diamond
•
No Contamination
is dispersed to areas of
bond are filled with
bond, where its needed
excessive number of
most. Every diamond
diamond particles. In other
works at the right place
bond layers, diamond
and at the right time.
particles are rarely
The sharpest part of the
sighted. In a few
diamond particle almost
occasions material comes
always peruses from the
in contact with overly
bond, growing sharper
excessive number of
with each cut.
diamonds. In other cases,
Sectioning Materials with High Metallic Content
Historically conventional Metal Bonded Diamond Wafering Blades
had problems in cross sectioning high metallic content
specimens. It could take hours cross sectioning materials such
as titanium and tungsten carbide with a diamond blade. Most
laboratories use abrasive cut-off blades for this application. NEW
GENERATION Sintered (metal bond) Diamond Wafering Blades SMART CUT technology actually do a good job on metals, not
just ceramics. See graph below for comparison of cutting speeds
on high metallic content materials. Here is an example of typical
there are almost no
diamonds to be found.
User must periodically
dress blade, to rexpose
bond layers. Until new
diamonds can be found.
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
Metallographic Diamond Blade Case Studies
Wafering Blade Performance & Cutting Speeds
Case Study No. 1
New Generation Sintered (metal bond) diamond wheel with SMART
CUT™ technology was tested against a conventional metal bond
diamond wheel under similar conditions. Using three different
materials, namely Aluminum, Brass, and Quartz, cuts were made to
determine cutting times for all five diamond wheel types.
Cutting Parameters
Load: 80 grams Blade Dressing: Prior to each cut Wheel
Speed: 10 maximum on dial) Coolant Density: 30:1
Each cut was timed and recorded, with each cut averaged for
each sample and then plotted in a graph.
Using a Model 650 Low Speed Diamond Wheel Saw, each diamond
wheel blade was used for cutting the specified materials. Each
Results: New Generation, Sintered (metal bonded) Diamond
specimen cut was a 12-millimeter diameter rod of material, helping
Wafering Blades with SMART CUT technology cut
maintain consistency during the cutting process. Specimens were first
substantially faster than Conventional Sintered (metal bond)
mounted onto a graphite plate, which was then mounted onto an
diamond wafering blades. For all three materials.
aluminum mounting block.
The entire system was then placed into the Model 65001 Single Axis
Cutting Times of Various Materials Using Different
Goniometer specimen mount of the Model 650. Specimens were
Diamond Wheels
mounted using MWH 135 low melting point wax (melting point at 100
(All samples 12mm rods)
degrees Celsius). The following diamond wheels were used in this
experiment:
Wafering Blades Tested
Material
Conventional Diamond Wafering Blade, Sintered (metal bonded) 4”
Wafering Blades
diameter; 0.012” thickness; Mesh Size: coarse; Diamond
Concentration: High
New Generation, Sintered (metal bonded) Diamond Wafering Blade.
4” diameter; 0.012” thickness; Mesh Size: coarse Diamond
SMART CUT Diamond
Conventional Diamond
Wafering Blades
Quartz
4.5 minutes
10 minutes
Aluminum
26 minutes
29.5 Minutes
Brass
25.5 minutes
33.5 minutes
Concentration: High. With SMART CUT™ technology.
Case Study No. 2
Each diamond wheel was used to make three cuts on each sample,
with a total of nine cuts total per wheel. The diamond wheels were
dressed with a silicon carbide dressing stick immediately prior to
cutting. The following cutting parameters were used for each of the
cuts made.
A small rod of 100 steel: 6 chromium 15mm in diameter by
35mm in length was obtained for cutting tests. Three cuts
were made to evaluate cutting time, surface finish, and
accuracy of the cut (parallelism) using different diamond
wheels. The surface of the part following cutting was
inspected using an inverted optical microscope at low
magnification to qualitatively compare surface roughness.
The width of the sample following cutting (the thickness) was
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
measured to determine if any significant variation was observed in the
specimens. Finally, a comparison of cutting times was made to
compare the wheel cutting efficiency as well. The sample rod material
was cut using similar conditions for each diamond wheel.
Customer Comments: "We found that it worked well for
cutting all of alloys and pure metals. It worked extremely well
for sectioning carbide inclusions in Zircaloy. Before using
your blade, we have had little success sectioning these types
The sample was mounted onto the Model 650 Low Speed Diamond
of samples."
Wheel Saw using a Model 65006 Vise sample holder. A water-soluble
coolant was used to prevent excess heating during the cutting
Case Study No. 4
process, and was replenished after each cut. Cutting load was
applied to the specimen directly onto the arm mechanism, and the
counter-balancing weight was used to prevent wheel binding during
the cutting process. A total cutting load of approximately 600 grams
was used with the diamond wheel saw during each cut, and dressing
of the blade was done periodically every hour during the cutting
process.
Cutting times and thickness variations of diamond wheels
cutting 100 Steel: 6 Chromium sample
stainless steel disk bonded by a proprietary process to an
alumina ceramic insulator.
Customer Comments: “ I had previously mounted this
combo in epoxy and attempted to cut it on another
manufacturer's low speed wafering saw using both their
diamond blade and a wafering blade they had recommended
Wafering
Blade
Application: sectioning a client part consisting of a thick
Cutting Time Thickness (mm) Variation (mm)
Type
SMART CUT™
1.940 – 2.070 mm
8 hours
Diamond
Wafering Blade
Conventional
13 hours, 12 min 1.370 – 1.540 mm
Diamond
Wafering Blade
for cutting metal. Both blades did well on the ceramic but
even with constant dressing the cutting rate in the metal
0.130
0.170
Wafering Blades Tested:
New Generation Metal Bond Diamond Wafering Blade with SMART
CUT technology Mesh Size: 120
portion of the sample was infinitesimal and I gave up the
effort after a whole day of effort. Your blade cut the same
sample in approximately 15 minutes on the surface grinder
and rates in the stainless steel portion were only slightly
slower than in the ceramic. "
Conventional Diamond Wafering Blade. Mesh Size: 120
Case Study No. 5
Concentration: High
Sectioning Materials with High Metallic Content
Wafering Blade:
Material:
Specimen Size:
Saw Used:
6” x .020” x ½”
Low Carbon Steel
5/8”
Isomet 1000
Product: 10” x .040” x ½” New Generation metal bond Diamond
Wafering Blade with SMART CUT™ technology
Application: Zr, Nb, Ti, Hf, and their alloys. These are very tough,
ductile metals.
Cutting Speeds in Minutes
Smart Cut™ Wafering Blades: 1.51 Conventional Blade: 5.15
Conclusion: SMART CUT™ New Generation Metal Bond
Diamond Wafering Blades cut Copper 2.32 times faster
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
Cutting Speed for Cobalt Chromium
6
5
4
3
2
1
0
15
5.15
Hours
Minutes
Cutting Speed for Low Carbon Steel
1.5
13
10
8
5
0
SMART CUT
Wafering Blades
Conventional
Wafering Blades
Case Study No. 7
Case Study No. 6
Material: cobalt chromium
Wafering Blade:
Material:
Specimen Size:
Saw Used:
6” x .020” x ½”
Copper
3/4”
Isomet 1000
Specimen Size: 4.0" Saw: South Bay 650
Cutting Speed
Cutting Speeds in Minutes
Smart Cut™ Wafering Blades:
5.59 min Conventional Blade: 13 min
Conclusion: SMART CUT™ New Generation Metal Bond Diamond
Wafering Blades cut Copper 2.32 times faster
13
12
Minutes
6
4
2
0
conventional metal bond diamond wafering blade: 13
Conclusion: SMART CUT Diamond Wafering Blade cut
Cobalt Chromium 1.62 times faster
Case Study No. 8
10
8
Wafering Blade: 8 hours
hours.
Cutting Speed for Copper
14
SMART CUT™ New Generation Metal Bond Diamond
5.59
Saw used on: Isomet 1000 Low Speed Saw
Specimen Size: 2” x 1-1/2”
Wafering Blade: 5” x .014” x ½”
Material: Bone with metal implant. Pig aurora with
annuarysm bypassed by stent made from polymer with
metal bands embedded.
Cutting Speed
SMART CUT™ wafering blade: 20 minutes
Conventional Wafering Blade: 30 minutes
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
PROBLEM
Uneven Distribution
BEHAVIOR
RESULT
Diamonds too Far Apart – Easily Broken
Diamonds are too
Close
Together – Cannot
Penetrate
Weak Bonding
Short Tool Life
Pullout Crystals
Insufficient Diamond Exposure
Slow Cutting Rate/Speed
Diamond Concentration
Random
Diamond Waste
Regular
Diamond Spacing
Cost
UKAM Industrial Superhard Tools
Division of LEL Diamond Tools International, Inc.
25345 Avenue Stanford, Unit 211 Valencia, CA 91355 USA
Phone: (661) 257-2288 Fax: (661) 257-3833 www.ukam.com
SMART CUT precision Diamond Wafering Blades are designed
and specially selected to provide the maximum possible blade life
for your desired cut quality, and speed.
UKAM Industrial Superhard Tools is one of the leading manufacturers of high Precision Diamond
Wafering Blades in the world. From 0.5” to 72” OD, starting .001” TH and up. With over 50 years of
experience in manufacturing, research, and development. Following the belief .that there is always room
for improvement. We continue to raise standards for the whole industry. In addition to manufacturing
diamond wafering / sectioning blades for our own SMART CUT series Precision Diamond Saws. We
manufacture many Diamond Wafering Blades used on other well know sectioning / wafering saws.
We recognize that the Diamond Wafering / Sectioning Blade by itself is perhaps the most important factor
in your sectioning / precision diamond sawing operation. The diamonds impregnated inside the bond
matrix of the wafering blade, are what actually participate in cutting action. No matter how precision or well
made your wafering saw. You will not be able to obtain the material surface finish, and precision
tolerances you need, if the blade you are using is not right for your application
UKAM Industrial Superhard Tools proprietary blade chemistry, precision manufacturing methods, modern
quality control methods, allow us to control and regulate the dozens of variables that affect blade life,
quality of cut, surface finish. Reducing and often eliminating additional steps often required after
sectioning. All blades are manufactured to fit your specific material, application, and surface finish
requirements. We will work with you to determine your needs, and develop the right bond formulation,
concentration, and grit sizes.
UKAM Industrial Superhard Tools has one of the Largest Inventory of Precision Diamond Wafering
SMART CUT
technology.
Blades in the U.S. With over 4,000 diamond wafering blades in stock, available in different sizes,
thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness’s.
You are sure to find the Right Diamond Wafering Blade for your
application in stock and ready for same day delivery. If you are
not using these blades, you are paying too much.
Advanced
technology that
redefines the
standard in cutting.