Get Smart • Get Efficient • Get to Market Quickly GET CONNECTED with Future Connectivity Solutions ISSUE 02 FEATURED TECHNOLOGIES 802.15.4 / Sub-Gig Bluetooth Cellular Wi-Fi NEW PRODUCT INTRODUCTIONS PSoC4® 4 BLE: PSoC Now Integrates Bluetooth® Low Energy by Cypress Taking the world wireless HumRC™ Series Remote Control and Sensor Transceiver by Linx PAN1740 Place and Play Bluetooth® Low Energy Module by Panasonic Sierra Wireless AirPrime® Embedded Modules HL Series by Sierra Wireless 1 TABLE OF CONTENTS ISSUE 2 802.15.4 / SUB-GIG Linx - HumRC™ Series Remote Control and Sensor Transceiver Offers Amazing Flexibility in a Tiny, Low Cost Package! 3 BLUETOOTH Cypress - PSoC4® 4 BLE: PSoC Now Integrates Bluetooth® Low Energy 5 Microchip - BM77 Bluetooth® 4.0 Dual Mode Module 7 Panasonic - Panasonic: Place and Play Bluetooth® Low Energy Module 9 CELLULAR Multi-Tech - MultiTech’s MultiConnect® rCell - More than Just a Router! 10 Sierra - Sierra Wireless AirPrime® Embedded Modules HL Series 12 WI-FI Gainspan - HD / Full HD Video Application Development Kits 14 Murata - Wi-Fi® 802.11 b/g/n Network Controller Module 15 Silex - Silex: 802.11b/g/n and 802.11a/b/g/n Embedded Intelligent Wireless Modules 17 GET CONNECTED | ISSUE 2 2 HUMRC™ SERIES REMOTE CONTROL AND SENSOR TRANSCEIVER OFFERS AMAZING FLEXIBILITY IN A TINY, LOW COST PACKAGE! The HumRC™ transceiver is designed for reliable bi-directional remote control and sensor applications. The module includes a Frequency Hopping Spread spectrum (FHSS) protocol and supports versions at 2.4GHz and 900MHz with a common footprint and pin out in this initial release, with 868MHz and others to follow in the near future. This common footprint across the available frequencies also makes it suitable for global sale, so one product can be manufactured and sold around the world. Figure 1: Hum-900-RC Figure 2: Hum-2.4-RC Figure 5: HumRC Basic Module Footprint Figure 6: Combined HumRC Module Footprint (basic and future pre-certified design) APPLICATIONS Figure 3: EVM-900-RC • Remote control with global certifications • Electronic signage • Irrigation control • Home and industrial automation • Remote access control with confirmation • Remote status monitoring • Robotics BENEFITS • Simple long range remote control implementation • Optimized for battery powered devices • Bi-directional operation and selectable acknowledgements provide a great deal of functionality • Advanced features are available through a standard UART serial interface FEATURES • Low Cost (under $9 in volume) • No external RF components required • No programming/tuning required • Serial interface for optional software operation/configuration • Tiny PLCC-32 footprint Figure 4: EVM-2.4-RC TECHNOLOGY | 802.15.4 / SUB-GIG 3 PART SELECTOR TABLE PART NUMBER DESCRIPTION DEVELOPMENT KITS MDEV-900-RC HUM-RC Master Development System 900 MHz, USB Module MDEV-2.4-RC HUM-RC Master Development System 2.4 GHz, USB Module EVAL-900-RC HUM-RC Series Basic Evaluation Kit, 900 MHz EVAL-2.4-RC HUM-RC Series Basic Evaluation Kit, 2.4 GHz TRANSCEIVERS HUM-900-RC HUM-RC Series Remote Control and Sensor FHSS 10 dBm RF Transceiver 900 MHz HUM-2.4-RC HUM-RC Series Remote Control and Sensor FHSS RF Transceiver 2.4 GHz HUMMINGBIRD TRANCEIVERS ON BOARDS EVM-900-RC HUM RC EVM Module, 900 MHz, Pin mount with integrated RF connector EVM-2.4-RC HUM RC EVM Module, 2.4 GHz, Pin mount with integrated RF connector MDEV-900-RC MDEV-2.4-RC Master Development Kit EVAL-900-RC EVAL-2.4-RC Basic Evaluation Kit TECHNOLOGY | 802.15.4 / SUB-GIG 4 PSOC4® 4 BLE: PSOC NOW INTEGRATES BLUETOOTH® LOW ENERGY FEATURES/SPECS • • • • Figure 1: Bluetooth SMART PSoC 4 BLE is an easy-to-use, ARM® Cortex™-M0 based, singlechip solution which integrates programmable analog front ends, programmable digital peripherals, CapSense® technology for touchsensing, and a Bluetooth® LE (Low Energy) or Bluetooth Smart radio. Bluetooth Core Specification 4.1 48-MHz ARM® Cortex™-M0 CPU Up to 128 KB Flash and 16 KB SRAM Bluetooth Smart Connectivity with Bluetooth v4.1 Protocol Stack o 2.4 GHz Bluetooth Low Energy Radio with integrated Balun o -92 dBm Rx Sensitivity, +3 dBm Tx Output Power • Programmable analog o 4 x Opamps o 1 x 12-bit, 1-Msps SAR ADC o 2 x Low-Power Comparators o 1 x Cypress CapSense™ touch controller with SmartSense™ Auto-Tuning • Programmable digital o 4 x universal digital blocks o 4 x 16-bit configurable Timer/ Counter/PWM blocks o 2 x configurable serial communication blocks • Up to 36 GPIOs available in 56QFN (7x7x0.6 mm) and 68-CSP (3.9x2.5x0.55 mm) packages • Flexible Low Power Modes o 1.3-μA Deep-Sleep Current o 150-nA Hibernate Current o 60-nA Stop Current • Wide Operating Range 1.7 - 5.5 V (Radio operational 1.9 V onwards) http://wwww.cypress.com/psoc4ble APPLICATIONS • • • • • Internet of Things (IoT) Wearable Electronics Medical Devices Fitness Accessories Home Entertainment BENEFITS • Enables complete system design in PSoC Creator • Simplifies the BLE Protocol Stack and Profile configuration with the easy-touse BLE Component • Simplifies RF board design by integrating the Balun • Integrates programmable AFEs and digital logic, and CapSense with the ARM Cortex-M0 CPU and BLE radio • Delivers five flexible, easy-to-use, low-power modes Figure 2: PSoC 4 BLE One-Chip Solution TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 5 Demo, Evaluation or Developments tools The CY8CKIT-042-BLE development kit supports system-level designs using PSoC Creator which includes numerous example projects to enable Bluetooth Low Energy mixed signal embedded designs. The Bluetooth Low Energy v4.1 specification has been abstracted into the new Bluetooth Smart Figure 3: CY8CKIT-042-BLE Component in PSoC Creator, allowing for easy drag-anddrop designs. The development kit has been designed to allow for maximum design flexibility enabling Arduino shields hardware compatibility and easy to use, FCCcertified PSoC 4 BLE and PRoC BLE modules. Part Number: CY8CKIT-042-BLE PART SELECTOR TABLE PART NUMBER1 CPU SPEED UDB SCB2 TCPWM3 SAR4 ADC IDAC5 CY8C4127LQI-BL473 24 MHz 0 2 4 806 ksps 2 CY8C4127LQI-BL453 24 MHz 0 2 4 806 ksps 2 CAPSENSE OPAMPS COMPARATORS PACKAGE 2 2 56-QFN 2 2 56-QFN X PSoC 4 BLE Product Selector Guide CY8C4127LQI-BL483 24 MHz 0 2 4 806 ksps 2 X 2 2 56-QFN CY8C4127FNI-BL483 24 MHz 0 2 4 806 ksps 2 X 2 2 68-CSP Part Number1 CPU Speed UDB SCB2 TCPWM3 SAR4 ADC IDAC5 CapSense Opamps Comparators Package MHz4 02 2 ksps2 2 24 2 24 MHz 0 2 806 ksps 2 2 CY8C4247LQI-BL473 48 MHz24 CY8C4127LQI-BL473 CY8C4127LQI-BL453 CY8C4247LQI-BL453 48 MHz 4 2 CY8C4127LQI-BL483 24 MHz 0 2 CY8C4127FNI-BL483 24 MHz 0 2 CY8C4247LQI-BL463 48 MHz 4 2 CY8C4247LQI-BL473 48 MHz 4 2 CY8C4247LQI-BL453 48 MHz 4 2 CY8C4247LQI-BL463 48 MHz 4 2 CY8C4247FNI-BL483 48 MHz 4 2 AllCY8C4247FNI-BL483 part numbers support: Industrial temperature (-40ºC 48 MHz 4 to +85ºC), 36 GPIO, 128KB flash and input voltage range from 1.9 V to 5.5 V 1 PSoC 4 BLE Part Numbering Decoder 4 4 4 4 4 4 4 4 4 4 4 1 Msps806 2 ü 2 806 ksps 2 X ü 4 2 2 806 ksps 2 ü 2 2 1 Msps 1 Msps 1 Msps 1 Msps 1 Msps 1 Msps 2 2 2 2 2 2 Serial communication block 3 Timer, counter, pulse-width modulator block 2 4 1 Msps 4 2 ü X ü 4 2 4 2 4 2 4 2 56-QFN 56-QFN 56-QFN 2 56-QFN 56-QFN 68-CSP 2 2 56-QFN 56-QFN 56-QFN 68-CSP 56-QFN 4 Successive approximation register 5 Current-output digital-to-analog converter 4 2 68-CSP CY 8C 4X X X XX X BLXXX Device Identification Number that corresponds to the part feature set Temperature Range: I = Industrial Package: FN = CSP, LQ = QFN Flash Size: 7 = 128KB, 8 = 256KB CPU Speed: 2 = 24 MHz, 4 = 48 MHz Product Type: 42 = Programmable Digital, 41 = Intelligent Analog Marketing Code: 8C = PSoC Platform Company ID: CY = Cypress 1 All part numbers support: Industrial temperature (-40ºC to +85ºC), 36 GPIO, 128KB flash and input voltage range from 1.9 V to 5.5 V 001-92533 Rev ** 2 Serial communication block 3 Timer, counter, pulse-width modulator block Figure 4: PSoC 4 BLE Part Numbering Decoder Owner: GUL PSoC 4 BLE New Product Introduction TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 4 Successive 5 approximation register Current-output digital-to-analog converter 16 6 BM77 BLUETOOTH® 4.0 DUAL MODE MODULE APPLICATIONS Figure 1: BM77 The BM77 is a fully-certified Bluetooth® Version 4.0 (BR/EDR/ LE) module for designers who want to easily add dual mode Bluetooth wireless capability to their products. Delivering local connectivity for the Internet of Things (IoT), the BM77 bridges your product to Smart Phones and Tablets for convenient data transfer, control and access to cloud applications. This Bluetooth SIG certified (QDID:B021961) module provides a complete wireless solution with Bluetooth stack on-board, integrated antenna, and worldwide radio certifications in a compact surface mount package, 22 x 12 x 2.4 mm. It supports GAP, SDP, SPP, and GATT profiles. Data is transferred over the Bluetooth link by sending/ receiving data via transparent mode over UART, making it easy to integrate with any processor or Microcontroller with a UART interface. Configuration is made easy using a Windows® based GUI or directly via UART by a MCU. • • • • • • • • • Mobile Point of Sales (mPOS) LED lighting Wearables Digital Sport Fitness Health Care/ Medical On Board Diagnostics (OBD2) Home Automation Remote Control Toys BENEFITS • Supports both Bluetooth Classic and Bluetooth Low Energy for advanced flexibility and capability • Fully-certified module saves time and certification costs, speeding time to market • Easy to use UART interface for data transfer • Easy to configure using Windows app or direct with any microcontroller • Compact size (22 x 12 x 2.4 mm) for size-constrained applications FEATURES/SPECS • Fully certified Bluetooth Version 4.0 Module • Bluetooth Classic and Bluetooth LowEnergy Support • Bluetooth SIG Certified (QDID:B021961) • Onboard embedded Bluetooth Stack • Easy to use transparent mode for data transfer via UART • Multiple I/O pins for control and status • • • • Secure AES128 encryption GAP, SDP, SPP, GATT profiles 2dBm Transmit Power Firmware can be field upgradable via UART • Compact surface mount module: 22 x 12 x 2.4 mm • Castellated surface mount pads for easy and reliable host PCB mounting • Worldwide regulatory certifications Figure 2: BM77 Block Diagram TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 7 PART SELECTOR TABLE PART NUMBER DEVELOPMENT TOOL DESCRIPTION BM77SPPS3MC2-0007AA EV77SPPS3MC2A Bluetooth® 4.0 Dual Mode, Class 2, surface mount module with chip antenna BM77SPP03MC2-0007AA EV77SPPS3MC2A Bluetooth® 4.0 Dual Mode, Class 2, surface mount module with external antenna Figure 3: EV77SPPS3MC2A The BM77 Bluetooth® Dual Mode Evaluation Board (EVB) allows the designer to evaluate and demonstrate the capabilities of the BM77 Bluetooth 4.0 Dual Mode Module. The evaluation board includes an integrated Configuration and Programming USB interface for plug-andplay capability. It also includes on-board breakout pin header connections for convenient access to the BM77 electrical connections to enable rapid prototyping. TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 8 PANASONIC: PLACE AND PLAY BLUETOOTH® LOW ENERGY MODULE Figure 1: PAN1740 Series FEATURES • • • • • • Bluetooth® Smart Module Tx Current @0dBm: 5mA Small Footprint: 9 x 9.5 x 1.8mm High Sensitivity: -93dbm typ. Output Power Up to 0dbm Embedded BLE Stack and GATT Profile • Industrial Temperature Range: -40 to 85°C • Two Internal Crystal Oscillators • Integrated Antenna A revolution is underway in Bluetooth Low Energy to dramatically shrink power budgets for battery powered applications. Panasonic’s “nanopower” family of 2nd generation BLE modules reduces transmit and receive current consumption by more than 66% when compared to the current generation of BLE devices and nearly a 90% reduction from Bluetooth Classic devices. Most significant is that these current reductions have been achieved without range reduction, without Tx power reduction and without changes to the Bluetooth specification. The PAN1740 Series is Panasonic’s next generation “nanopower” Bluetooth Low Energy module with reduced form factor, significantly lower power consumption, embedded BLE stack and profile. Panasonic cost engineering lowers component count and the application BOM. The single mode Bluetooth system-on-chip module is optimized for lower power and small size. The power consumption of only 5mA in Tx or Rx mode allows for the use of coin cell batteries and reduces battery requirements up to 50% when compared to current generation BLE devices. With a fully shielded case, integrated crystal oscillators and chip antenna, the 9.0 x 9.5 x 1.8 mm footprint of the PAN1740 series make it one of the smallest BLE modules available. The PAN1740 Series is qualified to the Bluetooth 4.0 standard – FCC, IC, CE certifications are pending. Panasonic’s designer friendly Easy-to-Use (ETU) development kits reduce design efforts and critical time to market. BENEFITS • Increase battery life • Reduces module cost and the size of the end product • Increase range for reliable communication • Module works in harsh environments • Lowers the application BOM • Increased design flexibility APPLICATIONS • • • • • • Consumer Electronics Wireless Sensors Cable Replacement Instrumentation Heart Rate Monitor Blood Glucose Monitor Figure 2: Block Diagram (PAN1740) PART SELECTOR TABLE PART NUMBER DESCRIPTION ENW-89846A1KF EVAL-PAN1740 PAN1740 Bluetooth Low Energy Module, Integrated Antenna PAN1740 Evaluation Kit, Two USB Development Modules TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 9 MULTITECH’S MULTICONNECT® RCELL - MORE THAN JUST A ROUTER! PART SELECTOR TABLE PART NUMBER DESCRIPTION MTR-H5-B07 HSPA+ Router w/o Accessories MTR-H5-B07-US HSPA+ Router w/US Accessory Kit MTR-H5-B08 HSPA+ Router w/GPS w/o Accessories MTR-H5-B08-US HSPA+ Router w/GPS & US Accessory Kit MTR-H5-B09 HSPA+ Router w/Wi-Fi w/o Accessories MTR-H5-B09-US HSPA+ Router w/Wi-Fi & US Accessory Kit MTR-H5-B10 HSPA+ Router w/Wi-Fi /GPS w/o Accessories Figure 1: MultiConnect rCell 100 Series Routers MTR-H5-B10-US HSPA+ Router w/Wi-Fi/GPS & US Accessory Kit MTR-H5-B07-HZ HSPA+ Router w/Class I Div 2 Kit (US & Canada only) The MultiConnect® rCell 100 Series of cellular routers are a part of MultiTech’s comprehensive portfolio of cellular connectivity products optimized for M2M (machineto-machine) communications. With a powerful remote Device Management platform, active on all MultiConnect rCell 100 Series routers, truck rolls are a thing of the past! Optimizing efficiency and providing the most compelling return on investment to our customers. MTR-H5-B10-HZ HSPA+ Router w/Wi-Fi/GPS & Class I Div 2 Kit (US & Canada only) MTR-EV3-B07-N3 EV-DO Router w/o Accessories (Verizon) MTR-EV3-B07-N3-US EV-DO Router w/US Accessory Kit (Verizon) MTR-EV3-B08-N3 EV-DO Router w/GPS w/o Accessories (Verizon) MTR-EV3-B08-N3-US EV-DO Router w/GPS & US Accessory Kit (Verizon) MTR-EV3-B09-N3 EV-DO Router w/Wi-Fi w/o Accessories (Verizon) MTR-EV3-B09-N3-US EV-DO Router w/Wi-Fi & US Accessory Kit (Verizon) MTR-EV3-B10-N3 EV-DO Router w/Wi-Fi/GPS w/o Accessories (Verizon) MTR-EV3-B10-N3-US EV-DO Router w/Wi-Fi/GPS & US Accessory Kit (Verizon) MTR-EV3-B07-N16 EV-DO Router w/o Accessories (Aeris) MTR-EV3-B07-N16-US EV-DO Router w/US Accessory Kit (Aeris) The MultiConnect rCell 100 Series of cellular routers also offers a shared design approach across all major cellular technologies, and a long and stable lifecycle, all important considerations for M2M applications. MTR-EV3-B08-N16 EV-DO Router w/GPS w/o Accessories (Aeris) MTR-EV3-B08-N16-US EV-DO Router w/GPS & US Accessory Kit (Aeris) MTR-EV3-B09-N16 EV-DO Router w/Wi-Fi w/o Accessories (Aeris) MTR-EV3-B09-N16-US EV-DO Router w/Wi-Fi & US Accessory Kit (Aeris) MTR-EV3-B10-N16 EV-DO Router w/Wi-Fi/GPS w/o Accessories (Aeris) MTR-EV3-B10-N16-US EV-DO Router w/Wi-Fi/GPS & US Accessory Kit (Aeris) MTR-EV3-B10-N16-US-AR EV-DO Router w/Wi-Fi/GPS & US Assessory Kit (Aeris/Active) MTSIM-AR Pre-activated Aeris Mini SIM Card MTR-C2-B16-N3 1xRTT Router w/o Accessories (Verizon) MTR-C2-B16-N3-US 1xRTT Router w/US Accessory Kit (Verizon) MTR-C2-B17-N3 1xRTT Router w/GPS w/o Accessories (Verizon) MTR-C2-B17-N3-US 1xRTT Router w/GPS & US Accessory Kit (Verizon) MTR-C2-B16-N16 1xRTT Router w/o Accessories (Aeris) MTR-C2-B16-N16-US 1xRTT Router w/US Accessory Kit (Aeris) MTR-C2-B17-N16 1xRTT Router w/GPS w/o Accessories (Aeris) MTR-C2-B17-N16-US 1xRTT Router w/GPS & US Accessory Kit (Aeris) BENEFITS • Fully certified and carrier approved for use in the U.S., Canada, European Union and Australia • 5-7 year product lifecycle • Wide selection of cellular technologies and models to optimize deployment needs • Remote Device Management to simplify and scale deployments at no additional cost • Quick deployments to shorten time to market • Lowest total cost of ownership For information on European and Australian models, contact your Future representative. TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG 10 PART SELECTOR TABLE MODEL MTR-H5-XX MTR-EV3-XX MTR-C2-XX Technical Specifications Performance HSPA+ EV-DO cdma2000 1xRTT Frequency Band Hepta-band 800/850/900/ AWS 1700/2100 MHz Quad-band 850/900/1800/1900 MHz Dual-band 800/1900 MHz Dual –band 800/1900 MHz Packet Data Up to 21.0 Mbps DL Up to 5.76 Mbps UL Up to 3.1 Mbps DL Up to 1.8 Mbps UL Up to 153.6K DL Up to 153.6K UL SMS Point-to-Point Messaging, Mobile-Terminated SMS, Mobile-Originated SMS Point-to-Point Messaging, Mobile-Terminated SMS, Mobile-Originated SMS Point-to-Point Messaging, MobileTerminated SMS, Mobile-Originated SMS Operating Voltage 7V to 32V DC Connectors SIM Interface Standard 1.8 and 3V Mini SIM receptacle N/A N/A Physical Description Physical Dimensions 4.17” x 3.0” x 1.15” (10.6cm x 7.6cm x 2.9cm) Environmental Operating Temperature -40° to +185°F (-40°C to +85°C) Storage Temperature -40° to +185°F (-40°C to +85°C) Humidity Relative humidty 15% to 93% noncondensing Certifications Regulatory FCC Class B (US), IC (Canada), R&TTE (EU Economic Area), A-Tick (Australia/NZ) FCC Class B (US) FCC Class B (US) Safety UL60950-1 (US), UL 201 (US), Class I Div 2 (US & Canada), cUL60950-1 (Canada), IEC60950-1 (EU Economic Area), AS/NZS 60950.1 (Australia/NZ) UL60950-1 (US), UL 201 (US), Class I Div 2 (US and Canada) UL 60950-1 (US), UL 201 (US) Network PTCRB, GCF approved module, AT&T, T-Mobile, Telstra, EU carriers Pending: Rogers, Bell, Telus Aeris, Verizon Pending: Sprint Verizon, Aeris Quality MIL-STD-810: High Temp, Low Temp, Cold Dwell, Random Vibration & Sine Vibration SAE J1455: Randon Vibration & Sine Vibration FEATURES • HSPA+, EV-DO and CDMA2000 1xRTT • Secure and manage remotely with Device Manager • 10/100BaseT Ethernet LAN connectivity • RS-232 serial port with Modbus support APPLICATIONS • External SMA antenna connector for improved range & performance • Models available with Wi-Fi®, Bluetooth® and GPS connectivity • Class I Div 2 models for U.S. and Canada • Two-year warranty, upgradeable to five years TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG • • • • • • Digital Signage Smart Vending Kiosks/POS Remote Monitoring Smart Energy Home Medical Monitoring 11 SIERRA WIRELESS AIRPRIME® EMBEDDED MODULES HL SERIES Compact, Flexible, and Future Proof 2G, 3G, and 4G Essential Modules Sierra Wireless AirPrime® HL embedded modules offer everything device manufacturers need to meet essential connectivity requirements for machine-to-machine (M2M) applications such as healthcare, point of sale terminals, fleet management, tracking, and consumer electronics. Figure1: HL Series Key differentiators include a common form factor, small size, low-power consumption, enhanced RF performance, optional GNSS (GPS and GLONASS), and worldwide coverage. COMPACT: THE SMALLEST 2G TO 4G FORM FACTOR ON THE MARKET Figure 2: Snap-in option or solder-down design The HL Series is the smallest module on the market sharing a common form factor across 2G, 3G, and 4G technologies. Now, with just one PCB design, device manufacturers can easily integrate voice and data connectivity and deploy in any region, on any wireless mobile network. The compact form factor offers the choice of soldering down the module for efficient high-volume production or, using a snap-in socket on the same solder pads for total flexibility in prototyping or smaller volume runs. The innovative snap-in socket allows device manufacturers to deploy or change modules at any point in the production and product life cycles. FUTURE PROOF: INTELLIGENT PIN-TO-PIN COMPATIBILITY TO SUPPORT EVOLVING TECHNOLOGIES The core and extension pins on the common form factor enables forward and backward compatibility between the different 2G, 3G, and 4G module variants. This means that the mechanical pin location delivers the same function across the series. The optional custom pins allow for new features as technology evolves making it the most future proof module on the market. KEY FEATURES KEY BENEFITS • Smallest 2G to 4G form factor on the market • Device management made easy with ready-to-use firmware upgrades using AirVantage Management Service FLEXIBLE: SOLDER DOWN OR CHOOSE THE SNAP!IN SOCKET TO SWITCH MODULES ANY TIME • Use one design for your 2G, 3G, and 4G deployments • Choose between LGA solder-down or snap-in integration, for supplychain and lifecycle management requirements TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG • GSM/GPRS/EDGE/HSUPA/HSDPA/ LTE • GNSS (GPS + GLONASS) • Dual SIM Dual Standby technology for maximum network connectivity 12 DEVELOPMENT KIT Figure 3: AirPrime HL6528 Development Kit • Network Technology: GPRS, GSM • Frequency Bands: 850/900/1800/1900 MHz • Carrier Certifications: Orange, Telefonica, Vodafone • Regulatory Certifications: R&TTE, CE, GCF-CC, FCC, PTCRB, RoHS Compliant • Antenna Diversity Support: No • Operating temperature: -40°C to +85°C • Form factor: Solder-down / SMT Mounting TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG This development kit includes: • 1 AirPrime HL6528 module on socket boards • 1x HL Series development kit mother board • 1x power supply AC100/240V, DC 4V/2.5A • 1x multiple AC outlet adaptor • 1x integrated quad-band GSM antenna/ penta-band WCDMA/ GPS & Glonass (SMA) • 1x handset with cable 13 GAINSPAN : HD / FULL HD VIDEO APPLICATION DEVELOPMENT KITS Everything you need to quickly and easily develop and deploy a wide variety of applications using GainSpan technology. Figure 1: Video ADK GainSpan’s Video Application Development Kits (ADKs) accelerate time to market for customers seeking to add high-quality HD / Full HD video streaming capabilities to their IOT (Internet of Things) products. The video ADKs include reference hardware designs integrating GainSpan’s Wi-Fi modules with leading video encoder SOC vendors; embedded software integrating streaming protocols including RTSP, UDP; and mobile applications for smartphone/tablets. These ADKs are built on the new ultra-low power GS2000 Wi-Fi SOC and leverage the key advantages of the GS2000-high data rates supported in the 802.11b/g/n SoC, multi-mode connectivity, extremely low standby current and fast wake up, and low power operation. Multimode connectivity enables concurrent connection to smartphone, cloud and a variety of other IOT devices in the home such as door locks, smartplugs, smart thermostats etc. The video ADKs enable a whole slew of video applications aimed at markets such as battery powered IP cameras, PIR camera, doorbell cameras, intercom systems, wearables, remote controlled toys, and automotive aftermarket. FEATURES BENEFITS • Complete reference design for streaming video applications • Supports HD (720p60/1080p30) H.264 RTSP and UDP streaming • High data throughput over SDIO / SPI • Fast wake up • Low power consumption • mDNS / Bonjour discovery • Multi-mode connectivity – concurrent support for limited AP/client; web server / client • Hardware encryption • Multiple provisioning methods • Over-the-air Firmware upgrade • Fast time to market • Excellent video quality with support of high resolution video • Low latency • Supports battery powered applications • Easy connectivity to mobile devices • Simultaneous connectivity to smartphone and cloud • Management of IOT devices in the home through a camera product • Secure video • Easy provisioning of the cameras / IOT devices using iOS/Android devices • Easy software upgrade of customer product in the field APPLICATIONS • • • • Security / IP Cameras Wi-Fi Doorbells Baby Monitors PIR cameras • Intercom systems • Wearable video • Automotive backup camera PART SELECTOR TABLE PART NUMBER DESCRIPTION GS-ADKVideoGeo1080p Full HD 1080p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, mobile applications (iOS and Android), supports multiple streaming protocols including RTP/RTSP and UDP. Planned support for cloud connectivity. GS-ADKVideoGeo720p HD 720p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, mobile applications (iOS and Android), supports multiple streaming protocols including RTP/RTSP and UDP. Planned support for cloud connectivity. GS-ADKVideoOV720p HD 720p30 resolution, OV 9712 image sensor, OV788 encoder, GS2011MIZ low-power Wi-Fi module, mobile applications (iOS and Android), supports multiple streaming protocols. GS-AEKVideoGeo1080p Full HD 1080p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, supports multiple streaming protocols including RTP/RTSP and UDP. Planned support for cloud connectivity. Includes binary version of the software. GS-AEKVideoGeo720p HD 720p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, mobile applications (iOS and Android), supports multiple streaming protocols including RTP/RTSP and UDP. Planned support for cloud connectivity. Includes binary version of the software GS-AEKVideoOV720p HD 720p30 resolution, OV 9712 image sensor, OV788 encoder, GS2011MIZ low-power Wi-Fi module, mobile applications (iOS and Android), supports multiple streaming protocols. Includes binary version of the software. TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 14 WI-FI® 802.11 B/G/N NETWORK CONTROLLER MODULE Model: SN820X SN820X MODULE FEATURES • 2.4GHz IEEE 802.11b/g/n • Chipset: Broadcom BCM43362 WiFi® and ST Micro • STM32 ARM Cortex-M3 • Supports WPA/WPA2 PSK, WPS • Supports Wi-Fi AP/STA Dual mode • Supports built-in TCP/IP Stack, SSL/ TLS, HTTP, DHCP, • DNS, and Web Server with: • Murata EZ Web Wizzard™ software or • Broadcom WICED™ SDK MODULE SPECIFICATIONS Figure 1: SN820X The SN820X is a family of small, low-power, self-contained, certified Wi-Fi® network controller modules that provide simple serial-to-WiFi® connectivity to the internet. These modules are an ideal solution for device manufacturers who are looking to add wireless connectivity to home appliances, smart energy systems, healthcare and industrial control equipment. Technology 2.4GHz IEEE 802.11b/g/n Antenna Configuration On-board or U.FL Connector Transmit power +18 dBm @b mode/11Mpbs Max receive sensitivity -96dbm Host Interface UART, SPI Sensor applications support GPIO, I2C, ADC, DAC Operating Temperature -40°C to +85°C The SN820X modules are enabled with Broadcom Corporation’s Wireless Internet Connectivity for Embedded Devices (WICED) architecture. They can host the WiFi®, TCP/IP network stack, security supplicant, and other network application features. Those features are supported by the Murata Simple Network Interface Controller (SNIC) software and EZ Web Wizzard™ platform. The modules are also compatible with Broadcom WICED SDK. Figure 2: Module Block Diagram SN820X SERIES SELECTOR TABLE MODEL NUMBER ORDERING PART NUMBER RAM SIZE FLASH SIZE SN8200 88-00151-00 96KB 768KB SN8200UFL 88-00151-02 96KB 768KB SN8205 88-00158-00 128KB 1024KB SN8205UFL 88-00158-02 128KB 1024KB TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 15 Figure 3: Package Dimentions (mm) EVALUATION BOARD FEATURES • SN820X Wi-Fi Network Controller • Mini-USB connector supporting USBJTAG and USBserial interfaces • Pads for headers to access the I/O pins of the SN820X module. • Serial fl ash (8M bits) and interface header • SHT21 temperature and relative humidity sensor • UART interface header SN820X FAMILY TABLE PART NUMBER MODEL NUMBER SN8200 EVK+ 88-00151-95 SN8200UFL EVK+ 88-00151-97 SN8205 EVK+ 88-00158-95 SN8205UFL EVK+ 88-00158-97 Figure 4: Evaluation Board TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 16 SILEX: 802.11B/G/N AND 802.11A/B/G/N EMBEDDED INTELLIGENT WIRELESS MODULES Serial/USB/Ethernet to Wi-Fi Modules FEATURES Figure 1: SX-580 The SX-570/SX-580 highperformance Serial/USB/Ethernet to Wi-Fi modules provide connectivity for low-power portable devices to 802.11 wireless networks (WLAN’s). Eliminating the need for the development of a wireless LAN driver and security supplicant, it is ideal for minimizing engineering investment and reducing time to market. Measuring 1.18 x 2.16 inches (30 x 55 mm), the SX-570/SX-580 features a powerful 32-bit 454 MHz Freescale i.MX28 processor with an 802.11a/b/g/n radio, a complete TCP/IP network protocol stack, and an optimized AR6003 wireless radio driver and security supplicant in a self-contained hardware package. One major advantage of the SX-570/SX-580 is enterprise security, including WPA2 with 802.1x authentication, which enables it to be used on almost any customer’s network without security compromises. Another feature enhancement is the implementation of the WPS feature which allows clients to easily connect to any network with WPA2 security. The SX-570/SX-580 is designed to connect to a wide range of OEM devices without the need for special software drivers or interface hardware. • Supports IEEE802.11a/b/g/n • Industry-leading enterprise security including WPA, WPA2, WEP plus 802.1x authentication • Supports Wi-Fi Protected Setup • AP Mode: Enables the SX-570/SX-580 to operate as an access point with support up to 10 connectable slots. • Supports Bluetooth as an option. • Freescale i.MX28 processor with an 802.11a/b/g/n radio, a complete TCP/ IP network protocol stack • Serial or Ethernet to Wi-Fi • Accepts setting changes from a serial • • • • port in Console Mode. Telnet and HTTP setting configuration is also available Can be used as a TCP/IP supported print server Complies with RoHS Directives Has an 8MB flash memory and a 64MB SDRAM. An option to upgrade the flash memory to 16MB SX-580-6900, evaluation board, is available for your development. This board includes an RJ45 Ethernet connector, three serial connectors, one USB connector, header connectors for all major I/O, AC adaptor, and a wireless LAN antenna Figure 2: Block Diagram PART SELECTOR TABLE PART NUMBER DESCRIPTION SX-580-2700 SX-580 802.11 a/b/g/n Intelligent Module Evaluation Kit SX-570-2700 SX-570 802.11 b/g/n Intelligent Module Evaluation Kit SX-580-2700-SP SX-580 802.11 a/b/g/n Intelligent Module Evaluation Kit (Single Pack) SX-570-2700-SP SX-570 802.11 b/g/n Intelligent Module Evaluation Kit (Single Pack) TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 17 BENEFITS • Based on Qualcomm Atheros AR6003. This game changing chip technology enables the SX-570/ SX-580 to provide breakthrough performance at the lowest cost. • Linux operating system with user programmability. The SX-570/SX-580 is uses the Linux operating system and is designed to allow users to easily add new features. With a 454MHz processor and 16MB of RAM and 8MB of flash memory, the SX570/SX-580 has plenty of capacity to handle complex user applications. • Reduced power consumption. The SX-570/SX-580 uses a minimum amount of power during transmitting and receiving, and its power management reduces power usage during periods of inactivity. APPLICATIONS • The SX-570/SX-580 highperformance intelligent modules are designed for connecting portable devices to 802.11 wireless local area networks (WLANs), and eliminate the need for the development investment of the wireless LAN driver and security supplicant. • They are ideal for OEM applications that need WLAN connectivity with minimal power usage, such as battery-operated portable devices for medical, printer, weights and measures, and other applications. Figure 3: Mechanical Specifications SPECIFICATIONS ITEM CPU MCIMX280CVM4B (Freescale) Clock Frequency 454MHz Radio SX-SDMGN (SX-570) SX-SDMAN (SX-580) FLASH ROM (SPI Interface) [Standard] 8MB S25FL064P0XNFI000 (Spansion) [UP] 16MB S25FL128P0XNFI000 (Spansion) SDRAM 64MB DDR2 (32M x 16bit Clock Frequency 205MHz (maximum) Ethernet PHY 10BASE-T 100BASE-TX LAN8720Ai-CP (SMSC) Interface To download these resources please visit http://fcs.futureelectronics.com/ UNIT NOTE (SX-570) IEEE802.11 b/g/n/e/i (SX-580) IEEE802.11 a/b/g/n/e/h/i Bluetooth 3.0 (unsupported to 3.0+HS) DOWNLOADABLE EXTRAS • Product Brief • Developers Reference and User Manual • Console Command Line Interface Documentation SPECIFICATION USB 2.0 OTG×1 USB 2.0 Host×1 Ethernet 10/100×1 1 port: CTS/RTS flow 2 port: No flow control UART ×3 SPI×1 I2C×1 Connector Type 50-pins connector Antenna Connector (SX-570 SX-580) U.FL Alternative Connector x 2 Weight SX-570 9 SX-580 10 g Dimension 55×30 mm MTBF 90,000 h TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE HIROSE : DF12-50DS-0.5V(86) W x H , PCB Thickness = 1.0mm. 18
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