参考出展 Exhibited for reference 耐溶 剤テープ Solvent-resistant Tape TSV 製 造 時における支 持 体剝離 後 の 洗 浄工程などに対応したテープ です。 ■ 洗浄によるしわなどの外観不良および洗浄液の浸入を防止 ■ 溶剤浸 漬後も UV 照射によって、被着体から容易に剝離が可能 This is a tape compatible with cleaning after hard support removal in TSV manufacturing and other processes. ■ Prevents wrinkles and other visual defects after cleaning as well as the incursion of solvent ■ After immersion in solvent, can be peeled easily from the adherend with UV irradiation プロセス例(デボンドプロセス) Process Example (De-bonding Process) 耐溶剤テープ Solvent-resistant tape 耐溶剤性比較 Comparison of Solvent Resistance 従 来品 Conventional product 支持体 Hard support 開発品 Development product TSV ウェハ TSV wafer しわ・しみ込みあり Wrinkles and seepage ウェハマウント Wafer mounting 支持 体剝離 Hard support removal 洗 浄(溶剤) Cleaning (solvent) 疎水性溶剤 For hydrophobic solvent 溶剤タイプ Solvent Type しわ・しみ込みなし No wrinkles or seepage 親 水性溶剤 For hydrophilic solvent 開発品 A Development product A 開発品 B Development product B テープ総厚 (μm) ※1 Tape Thickness 90 110 90 粘着剤厚み (μm) Adhesive Thickness 10 30 10 品名 Product Name UV 照射前粘着力 (mN/25mm) Adhesion before UV Irradiation 溶剤液 浸 漬前 ※2 1,000 1,800 14,500 溶剤液 浸 漬後 ※2 1,000 2,000 15,000 UV 照射後粘着力 (mN/25mm)※3 Adhesion after UV Irradiation 溶剤液 浸 漬前 ※2 50 100 80 溶剤液 浸 漬後 ※2 50 90 80 ※1 ※3 ※1 ※3 Before immersion in solvent After immersion in solvent Before immersion in solvent After immersion in solvent 剝離フィルムを除いた値 ※2 溶剤浸漬条件:r.t./10min 2 UV照射条件:照度230 mW/cm2、光量190 mJ/cm(主波長365 nm) Values, excluding peeling film ※2 Solvent immersion conditions: r.t./10 min UV irradiation conditions UV irradiation: 230 mW/cm2, UV intensity: 190 mJ/cm2, ultraviolet wavelength should be approximately 365 nm.
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