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Hybrid Integrated Circuits Market

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Hybrid Integrated Circuits Market – Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2018 – 2026
Hybrid Integrated Circuits Market – Global
Industry Analysis, Size, Share, Growth,
Trends, and Forecast 2018 – 2026
Hybrid integrated circuits, HIC or hybrid microcircuit is a miniaturized
electronic circuit constructed of individual devices, such as
semiconductor devices (such as transistors and diodes) and passive
components such as (resistor, inductors and capacitors), bonded to a
substrate or printed circuit board (PCB). Sometimes, the hybrid circuits
are also encapsulated in epoxy. A hybrid circuit serves as a component,
on a PCB in the same way as a monolithic integrated circuit, the main
difference between the two devices is how they are manufactured and
constructed.
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Thick film technology is mostly used as the interconnecting medium for
hybrid integrated circuits. The use of screen printed thick film
interconnect provides advantage of versatility over thin film although
feature sizes may be larger and deposited resistors wider in tolerance.
Multi-layer thick film is a technique for further improvements in
integration using a screen printed insulating dielectric to ensure
connections between layers are made only where it requires. These HIC
are very useful with many advantages such as, components that cannot
be used in the monolithic IC can be used in hybrid IC such as capacitor
of large value, wound components, crystals, inductors, the circuit
diagram is complete freedom in the choice of resistor value in thick film
technology, the composition and dimension of the circuit can be
selected to provide the desired values, the final resistor value is
determine by the design and can be adjusted by the laser trimming, and
many such benefits. The competency of hybrid integrated circuits to
choose resistor value in thick film technology and selection of the
composition and dimensions of resistors value is expected to drive
the hybrid integrated circuits market of hybrid integrated circuits.
More over low cost related to the hybrid IC’s is also expected to boost
the hybrid integrated circuits market during forecast period. However
the bigger size and low speed related to the hybrid IC’s may hamper the
global hybrid integrated circuits market during forecast period.
The global hybrid integrated circuits market is segmented on the basis
of types, application, and region. On the basis of type, the hybrid
integrated circuits market has been segmented into semiconductor
devices, passive components and others. The semiconductor segment is
expected to grow at the fastest rate in the forecast period followed by
the passive components segment. By application, the hybrid integrated
circuits market has been segmented into avionics and defense,
automotive, telecoms and computer industry, consumer electrons, and
other applications. The avionics and defense as well as the automotive
segment are expected to grow at the fast rate in the rate in the
application segment.
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In the region wise study, the global hybrid integrated circuits market
has been segmented into North America, Europe, Asia Pacific, Middle
East & Africa, and South America. North America which comprises The
United States, Canada and Mexico captured significant market share
followed by Europe and Asia Pacific in 2017. Asia Pacific showed the
fastest growth rate during the forecast period due to the emerging
economies. China represents huge potential for the hybrid integrated
circuits with the low cost of raw materials and huge production
facilities in the country. However, The U.S is expected to exhibit high
market growth over the forecast period owing to its early technological
advancement and high capital expenditure.
The global hybrid integrated circuits market is highly fragmented with
number of companies operating in the segment. Leading players are
currently focusing on providing cost competitive products and add-on
features to gain market share. Some of the companies operating in
hybrid integrated circuits market are Crane Interpoint, VPT(HEICO),
MDI, MSK(Anaren), IR(Infineon), GE , Techngraph , AUREL s.p.a.,
Cermetek, JRM, Siegert, ISSI, Custom Interconnect, Midas ACT, ETekNet and others.
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The report offers a comprehensive evaluation of the market. It does so
via in-depth qualitative insights, historical data, and verifiable
projections about market size. The projections featured in the report
have been derived using proven research methodologies and
assumptions. By doing so, the research report serves as a repository of
analysis and information for every facet of the market, including but
not limited to: Regional markets, technology, types, and applications.
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