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Final Program

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V I S I T U S O N T H E W E B A T: w w w. e w h . i e e e . o r g / s o c / c p m t / t c 1 /
FIRST CLASS
U.S. Postage
PAID
IEEE
New Brunswick, NJ
Permit No. 654
IEEE HOLM CONFERENCE
IEEE Meeting & Conference Management
445 Hoes Lane
Piscataway, NJ 08854
Final
Program
60TH IEEE
HOLM
CONFERENCE
ON
ELECTRICAL
CONTACTS
12 - 15 October 2014
Hilton New Orleans Riverside
New Orleans, LA USA
Sponsored By:
The Components, Packaging, and
Manufacturing Technology Society of
The Institute of Electrical and
Electronics Engineers, Inc.
2014 HOLM Co nference Officers
OPERATING COMMITTEE CHAIR
Brett Rickett, MOLEX, INC
OPERATING COMMITTEE VICE CHAIR
Z.K. Chen, ELECTRICAL CONTACTS PLUS, LLC
FINANCE CHAIR
Henry Czajkowski, ROCKWELL AUTOMATION/ALLEN-BRADLEY
TECHNICAL PROGRAM CHAIR
George T. Flowers, AUBURN UNIVERSITY
TECHNICAL PROGRAM VICE CHAIR
Daniel Gagnon, HYDRO QUEBEC IREQ
CPMT TECHNICAL COMMITTEE 1
ELECTRICAL CONTACTS CHAIR
Gerald Witter, ELECTRICAL CONTACTS PLUS, LLC
CPMT TECHNICAL COMMITTEE 1
ELECTRICAL CONTACTS VICE CHAIR
Robert Malucci, R.D. MALUCCI CONSULTING
PUBLICITY CHAIR
John J. Shea, EATON CORPORATION
INTENSIVE COURSE DIRECTOR, AND
US REPRESENTATIVE FOR THE
INTERNATIONAL CONFERENCE
Paul Slade, CONSULTANT
2014 HO LM Technical
Program Committee
TECHNICAL PROGRAM CHAIR
George T. Flowers, AUBURN UNIVERSITY
TECHNICAL PROGRAM VICE CHAIR
Daniel Gagnon, HYDRO QUEBEC IREQ
Milenko Braunovic, MB INTERFACE
Z.K. Chen, ELECTRICAL CONTACTS PLUS, LLC
Bella Chudnovsky, BHC CONSULTING
Ronald Coutu, AIR FORCE INST. OF TECHNOLOGY
Henry Czajkowski, ROCKWELL AUTOMATION/ALLEN-BRADLEY
George Drew, DELPHI PACKARD ELECTRIC SYSTEMS
Peter Hale, DERINGER NEY, INC.
Gary Haupt, CHECON CORPORATION
Guenther Horn, ELCONMAT CONSULTING ASSOCIATES
Robert Jackson, AUBURN UNIVERSITY
Chi Leung, METALOR ELECTROTECHNICS
Richard Moore, C&K COMPONENTS
Timo Muetzel, UMICORE AG & CO. KG
Marjorie Myers, TE CONNECTIVITY
Brett Rickett, MOLEX INC.
John J. Shea, EATON
Ed Smith III, DERINGER NEY, INC.
Philip Wingert
Gerald Witter, ELECTRICAL CONTACTS PLUS, LLC
Xin Zhou, EATON
2014 Ope rating Com m itte e
Brett Rickett, Chair
Z.K. Chen, Vice Chair
George T. Flowers, Technical Program Chair
Daniel Gagnon, Technical Program Vice Chair
Henry Czajkowski, Finance Chair
John Shea, Publicity Chair
Paul Slade, Course Instructor/International Rep.
Thomas Schoepf
Gerald J. Witter
2 0 1 4 Aw a r ds C o m m i t t e e
Gerald Witter
Robert Malucci
Sophie Noel
2 0 1 4 Pr iz e Pa p e r
Aw a r d C o m m i t t e e
Gary Haupt
Timo Muetzel
Peter Hale
1
Purpo se
To provide a forum for the presentation and discussion of
the latest developments in the field of electrical contacts,
as well as the application of recent advances in materials and processes in electrical, electronic and telecommunications equipment.
For
Wh o m
Practicing designers, engineers, physicists, and
research scientists-those new to the field and those
experienced. The 2014 IEEE Holm Conference will
include excellent papers authored by outstanding technical people in this field. The international contributors
come from the USA, Canada, China, France, Germany,
India, Japan, Korea, Malaysia, Poland, Sweden and the
United Kingdom. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer.
Additionally, the 2014 IEEE Holm Conference will make
it possible for any attendee to discuss personally, with
any author, either additional details concerning the work
presented by the author at the conference or any subject
related to the author’s field of expertise.
Backg round
The Holm Conference began in 1953 as a forum for the
discussion of electrical contact phenomena and related
fields. In 1968, the conference was named the Holm
Seminar in honor of Dr. Ragnar Holm, whose contributions to the field of electrical contacts spanned 50 years
and form the foundation of the electrical contacts field.
Dr. Holm inspired and guided the conference from its
inception until his death in 1970.
In addition to the Annual Conference, the Conference
Organization regularly conducts an intensive course on
contacts and participates in the biannual International
Conference on Electrical Contacts.
2
Re g is tr a tio n
All participants are encouraged to pre-register to avoid
lines at conference and to obtain the discounted fee.
CONFERENCE REGISTRATON
On/Before Aug. 29
IEEE Member
US$750
Non Member
US$825
Student/Life Member
US$300
After Aug. 29
US$825
US$900
US$350
INTENSIVE COURSE REGISTRATON
IEEE Member
Non Member
US$1600
US$1675
US$1800
US$1875
CONFERENCE & INTENSIVE
COURSE REGISTRATION
IEEE Member
Non Member
US$2100
US$2250
US$2375
US$2525
CONFERENCE REGISTRATION HOURS
Sunday, 12 October
4:00PM – 6:00PM
Monday, 13 October
7:00AM – 5:00PM
Tuesday, 14 October
8:00AM – 4:30PM
Wednesday, 15 October
8:00AM – 4:00PM
Registration can be completed online:
http://www.cvent.com/d/54q2kc
Registration payments:
Checks are to be made out to the IEEE HOLM in US$.
Visa, MasterCard, Discover, and American Express are
accepted.
For additional information please contact Holm Registrar, at:
US and Canada: +1 800 810 4333
Elsewhere: +1 732 465 7810
Email: [email protected]
WELCOME RECEPTION
All conference attendees are invited to register early and
to attend our welcome reception on Sunday, 12 October
from 4:00 PM – 6:00 PM at the Hilton New Orleans
Riverside in New Orleans, Louisiana.
3
H o te l Ac c o m m o d a tio n s
60th IEEE Holm Conference on Electrical Contacts
The 2014 conference meets in New Orleans, Louisiana at the
Hilton New Orleans Riverside, where meeting facilities are well
suited to the conference sessions and other activities. The hotel
is offering special rates of US$199* single/double occupancy to
conference attendees. Rates are subject to 13% tax and $3.00
per night occupancy tax. To make a reservation please use the
Holm Conference link https://aws.passkey.com/g/21041167 or
call the Hilton Reservations 1-800-HILTONS and reference the
“IEEE HOLM Conference” in order to receive the group rate. The
rate is valid until 12 September 2014 at 5:00PM CST.
Reservations received after this date will be subject to space and
availability.
Check in time: 3:00PM
Check out time: 12:00PM
Hilton New Orleans Riverside
Two Poydras Street
New Orleans, Louisiana, 70130 USA
+1 504 561 0500 or 1-800-HILTONS
*IEEE MCM receives 10% commission from the hotel on sleeping
rooms acquired during the conference. Commission helps to offset
expenses that IEEE Holm Conference incurs when selecting and booking a conference venue.
Tr a n s p o r t a t i o n
Airport and Driving Directions
http://www3.hilton.com/en/hotels/louisiana/hilton-new-orleansriverside-MSYNHHH/maps-directions/index.html
New Orleans Int’l (Moisant Field):
Distance From Hotel: 13 miles
Limousine
$115.00 USD
Super Shuttle
$20.00 USD
Taxi
$33.00 USD
Lakefront Airport
Distance From Hotel: 10 miles
Limousine
$70.00 USD
Taxi
$15.00 USD
Driving:
If you are arriving by your own transportation, parking fees at
the Hilton New Orleans Riverside are as follows:
Daily Self-Parking:
Valet Parking:
$31.25/day USD
$39.29/day USD
For specific driving directions from the New Orleans Int’l
Airport or Lakefront Airport, consult Map Quest at
www.mapquest.com or call the hotel directly at +1
504.561.0500.
4
So c ia l Eve n t
Conference Banquet
Audubon Aquarium of the Americas
Monday, 13 October 2014
6:00PM
Located on the Mississippi River adjacent to the French
Quarter Audubon Aquarium of the Americas immerses
you in an underwater world. The colors of a Caribbean
reef come alive in our walk-through tunnel, while our
penguins and Southern sea otters enchant you with their
antics. Touch a stingray, feed a parakeet, and marvel at
our gigantic sharks, tarpon, and rays in the 400,000 gallon Gulf of Mexico Exhibit. Watch for sea turtles throughout the Aquarium—as coordinator of the Louisiana
Marine Mammal and Sea Turtle Rescue Program, we
prepare many of them for release to the wild. The
Aquarium is located at 1 Canal Street Street, New
Orleans, LA 70130.
Each conference attendee will receive a ticket to attend
the social event at the Audubon Aquarium of the
Americas. Additional tickets may be purchased for the
rate of $80 USD.
IE E E H o l m
IE E E
5
H o lm Co n f e r e n c e
Ra g n a r H o lm Sc ie n tif ic
A c h i e v e m e n t Aw a r d
No m in a tio n G u id e lin e s
History: The Ragnar Holm Scientific Achievement
Award was created by the 1971 Holm Conference
Steering Committee in honor of the memory of Dr.
Ragnar Holm, the founder of the modern science of electrical contacts. This award is to be granted to the living
scientist or engineer who has made significant contributions to the theory or practice of electrical contacts, or for
work in related technologies which is directly applicable
to contacts. In considering a person’s work and selecting a recipient preference will be given for: a.) Nominees
that have made contributions to the technology over
many years, b.) the originality and scientific importance
of contributions, and c.) achievements that have found a
high degree of practice. Provided worthy candidates are
found, the Award will be granted annually.
Eligibility: Any person may be nominated for this award
regardless of IEEE membership. Members of IEEE
Holm Awards Committee are not eligible to be considered for the award while serving on this committee.
Nominations are not accepted for persons deceased.
Candidates must have made contributions to the electrical contact field for a period spanning at least ten years.
Nominator Eligibility: Any person may nominate a candidate for this award, with the following exception: members of the award committee.
Nomination Support Materials
Endorsers: At least two letters of endorsement are
required. One is from the nominator and the others are
from the endorsers selected by the nominator.
Endorsers should be in a position to substantiate the
candidate’s contributions by providing explicit detail from
personal knowledge. The nominator is responsible for
submission of the letters of endorsement.
6
Candidate Personal Data/Education/Work: “Name”,
provide complete name of candidate, not initials.
“Personal”, provide date of birth, and citizenship.
“Education”, list year and exact degree of institute.
“Society Membership”, list various professional society
affiliations. Under society activities list officers and major
committee work. “Professional History”, list present
occupation followed by previous career experiences.
Indicate positions held, years, and briefly explain each
responsibility.
Technical Accomplishments: “Technical Publications”,
such as books, papers, reports, and standards are to be
listed in chronological order giving author’s names, title,
book, journal, or proceedings. “Patents”, should be listed by date, number, title, and country of origin.
Documentation authentication “Development of Products
or processes”, may be listed for items not covered by
patents. “Technical Presentations”, such as keynote
addresses or courses developed by the candidate
should also be listed.
Significant Contributions: Describe the candidate’s
outstanding contributions in terms of specific items.
Provide a short paragraph to each one including a general description of the item, the degree of originality and
creativity, and importance of the work to the electrical
contact field and the time period over which the contribution was made. Also, state cases of examples of practices which were developed or modified through contributions of the candidate.
Forward Nominations To: IEEE Holm Nominations
Committee, c/o IEEE Holm Conference Planner, 445
Hoes Lane, Piscataway, NJ 08854 USA
2015 Nominations Deadline: 17 January 2015
7
H o lm 2 0 1 5
THE 61ST IEEE HOLM CONFERENCE
ON ELECTRICAL CONTACTS (2015)
The 61st IEEE Holm Conference on Electrical Contacts
will be held October 11-14, 2015 in San Diego,
California, USA.
Prospective authors should submit a brief abstract (200
words maximum) online before February 3, 2015.
Authors will be notified concerning acceptance of
abstracts by February 23, 2015.
Please include complete contact information for all correspondence to be sent.
Abstract information will be located on the Holm
Conference Website http://www.ewh.ieee.org/soc/cpmt/tc1/h2015/h2015top.html
February 3, 2015
February 23, 2015
April 24, 2015
October 11, 2015
Important Dates
Abstract Deadline
Notification of Acceptance
Paper Submission Due Date
Conference Begins
Correspondence Address
IEEE Meeting & Conference Management
IEEE Holm Conference (2015)
445 Hoes Lane
Piscataway, NJ 08854
US and Canada: +1 800 810 4333
Elsewhere: +1 732 465 7810
Fax: +1 732 465 6447
Email: [email protected]
Holm Website:
www.ewh.ieee.org/soc/cpmt/tc1/
8
M o r to n An tle r Le c tu r e
The Morton Antler Lecture is an annual technical presentation
given at the IEEE Holm Conference on a topic of special interest to the electrical contact community. The lecture series was
established in honor of Dr. Morton Antler, a long time member
of the Holm Steering Committee and participant in the Holm
Conference. Dr. Antler was a distiguished scientist and lecturer in the fields of electrical contacts, tribology, corrorsion, and
electrodeposition.
So …. What's All This Wireless Power Transfer
Stuff About Anyway??
John Yurtin
Delphi Connection Systems
Abstract:
The technology of wireless power
transfer has been around for over 100
years, and has been applied in various
industries. In the automotive industry,
wireless charging has been effectively
applied to electric and hybrid vehicles.
The present reliance on personal
mobile devices has opened up a
quickly expanding desire for wireless
power transfer to eliminate charge
cords and the associated charging
adaptors necessary to keep our phones charged. Wireless
charging of cell phones in the vehicle is not only a safety
issue by eliminating the distraction of fumbling for charge
cords while driving, but also a customer driven convenience
similar to the convenience offered for vehicle charging. This
movement of applying wireless power transfer has many additional applications in both the automotive and consumer
industries. With technology developments, it is expected that
wireless power transfer may effectively be applied in vehicles
to power devices, sensors, control modules, and illumination
eliminating wiring and connections. Stretching our imaginations, it may eventually lead to non-contact connection systems. As with other industry wide technologies, wireless
power transfer will be driven by standards. Multiple standards
organizations are presently competing for their positions, and
will be a major significance to wide scale implementation.
John Yurtin is a Product Specialist with Delphi Connection
Systems in Warren Ohio. John has over 47 years of experience in components and inter-connect technology develop-
9
ment, including global overseas assignments as well as various Engineering positions. He is the major technical resource
to Delphi’s global customers and leads an activity of communicating connection system technology to those customers,
personnel and organizations. John’s present responsibilities
also include Global Product Management of Data
Connectivity Systems including Wireless Device Charging for
automobiles. Holding 16 patents, John is a member of the
Delphi Innovation Hall of Fame, and is a major Delphi
Packard Electric representative to the outside industry. John
is a key participant in the standards industry, particularly with
SAE, USCAR, IEEE, 1394TA and ISO, for which he is the
U.S. representative on several ISO committees as well as
chairman of the US Technical Advisory Group to ISO. John is
an SAE “Fellow”, and was awarded the SAE Outstanding
Achievement Award in 2012 for his significant technical contributions.
10
Er le Sh o b e r t Pr iz e Pa p e r
The Holm Conference Prize Paper Award was established in
1970. At that time, the Conference Steering Committee recognized that at each Conference there was at least one paper that
stood out from the others in its technical content and quality of
presentation. Therefore, the Prize Paper Award Committee
was established. The Committee’s purpose is to review each
paper, listen to each presentation and then judge which paper
should receive the Prize Paper Award. The award is presented to the authors of the Prize Paper at the following year’s
Holm Conference.
2 0 1 3 IE E E E r l e S h o b e r t
Pr iz e Pa p e r
Characterization of EMI/RFI in Commercial and
Industrial Electrical Systems
Xin Zhou, Eaton Corporation, United States,
John Shea, Eaton Corporation, United States; and
Birger Pahl, Eaton Corporation, United States
11
The Arm ington
Re cognition Award
2014 ARMINGTON RECOGNITION AWARDEE
XIN ZHOU
Dr. Xin Zhou (M’96-SM’03) received his
B.S. degree in Engineering Mechanics
from Tsinghua University, Beijing,
China in 1987, and his M.S. and Ph.D.
degrees in Mechanical Engineering
from the University of Minnesota,
Minneapolis in 1991 and 1995, respectively.
From 1995 to 1996, he was with
Phoenix Solutions Company as a plasma technology specialist responsible
for developing and designing plasma torch systems for waste
remediation. He joined Eaton Corporate Research and
Technology in Milwaukee as a research engineer in 1996. His
research projects include arc interruption, arc fault /arc flash
detection and mitigation, next generation product development
in power control and distribution, optical emission spectroscopy
and plasma enhanced material processing. He is currently the
research & technology manager of the Arc Physics and
Switching Devices team with Eaton Corporate Research and
Technology.
Dr. Zhou is the recipient of the Eaton Innovation Award for both
2008 and 2010, and the Eaton Engineer of the Year Award for
2011. He has 56 patents issued or pending and published 39
Journal and conference papers. He is a senior IEEE member
since 2003. He has been actively participating and contributing
to the IEEE Holm Conference since 1991 as an author and a
member of various committees of the Holm conference. He
served as chair of the technical committee of the IEEE Holm
Conference from 2005 to 2007. He is a recipient of the IEEECHMT Graduate Fellowship Award for Research on Electric
Contacts for 1991-1992. He is also the recipient of the 1993,
2003, 2011, and 2013 IEEE Erle Shobert Prize Paper Award.
12
Su p p o r te r s o f
T h e 6 0 t h IE E E H o l m
Co nf e re nce o n
Ele c tr ic a l Co n ta c ts
Platinum Level
Checon Corporation
Heraeus Materials Technology GmbH & Co. KG
Hindustan Platinum
Multi-Contact
Umicore Technical Materials N.A.
Gold Level
Applied Relay Testing Ltd
Electrical Contacts Plus, LLC
NAECO
TECHNIC Inc.
TE Connectivity
Silver Level
Deringer Ney, Inc.
Eaton
Metalor Technologies Americas
Bronze Level
Molex, Inc.
13
Te c h n i c a l P r o g r a m
MONDAY, 13 OCTOBER 2014
8:00AM
INTRODUCTION AND OPENING REMARKS
Brett Rickett, 2014 IEEE Holm Conference Chair
8:10AM – 9:10AM
ARCING CONTACTS I
CHAIR: GERALD WITTER
CO-CHAIR: GUENTHER HORN
1.1
Reduction of AgSnO2 Contact Resistance by
Changing the Brazing Method and Corresponding
Improvement of an 18.5kW Contactor
Jean-Luc Wintz, Metalor; Sebastien Hardy, Metalor
Technologies SAS France
1.2
The Threshold Welding Current for Large Area
Closed Contacts with �n’ Points of Contact for
Short Duration, High Fault Currents
Paul Slade, Consultant
1.3
Influences of Contact Opening Speeds in the
Range of 0.5 to 200mm/s on Break Arc Behaviors
of Ag and AgSnO2 Contacts in DC14V Inductive
Load Circuits of 1 to 5A
Makoto Hasegawa, Chitose Institute of Science and
Technology; Hiroya Sonobe, Chitose Institute of
Science and Technology; Yuki Ohmae, Chitose
Institute of Science and Technology
9:10AM – 9:25AM
BREAK
9:25AM– 11:05AM
YOUNG INVESTIGATOR
CHAIR: ED SMITH
CO-CHAIR: DANIEL GAGNON
2.1
Arc Fault Detection Based on Temporal Analysis
Jinmi Gregory Lezama Calvo, UniversitГ© de Lorraine
- Hager Electro SAS; Patrick Schweitzer, UniversitГ©
de Lorraine; Serge Weber, UniversitГ© de Lorraine;
Etienne Tisserand, UniversitГ© de Lorraine; Patrice
Joyeux, Hager Electro SAS
14
2.2
A Third Body Contact Model for Particle
Contaminated Electrical Contacts
Hamed Ghaednia, Auburn University; Robert L.
Jackson, Auburn University; Jinchun Gao, Beijing
University of Posts and Telecommunications
2.3
Diagnostics of the Transmission Properties of
the Slip Ring System in Doubly Fed Induction
Generators
Hermann Houenouvo, Elektrotechnisches Institut,
Technische Universität Dresden; Wilfried Hofmann,
Elektrotechnisches Institut, Technische Universität
Dresden
2.4
Impact of Thermal Cycling and Background Gas
Environment on Tin Whiskering
Erica Snipes, Auburn University; George Flowers,
Auburn University; Pradeep Lall, Auburn University;
Michael Bozack, Auburn University
2.5
Research on Storage Degradation Testing and
Life Prediction Based on ARMA and Wavelet
Transform Model for Aerospace Electromagnetic
Relay
Zhaobin Wang, Jiangsu University of Science and
Technology; Shang Shang, Jiangsu University of
Science and Technology; Guofu Zhai, Harbin Institute
of Technology; Wanbin Ren, Harbin Institute of
Technology
11:05AM – 11:20AM
BREAK
11:20AM – 12:20PM
POWER
CHAIR: CHI LEUNG
CO-CHAIR: RICHARD MOORE
3.1
Electric-Thermal Performance of Contact
Elements in High Power Plug-In Connections
Michael Gatzsche, Technische Universität Dresden;
Nils Lücke, Technische Universität Dresden;
Steffen Großmann, Technische Universität Dresden;
Tom Kufner, Multi-Contact AG; Benjamin Hagen, MultiContact AG; George Freudiger, Multi-Contact AG
15
3.2
Contact Voltage Analysis for Degraded Contact
Surface by Power Arcing Phenomenon
Elsa Yee Kin Choi, University of Rennes 1, Metalor
Technologies SAS France; Erwann Carvou,
University of Rennes 1, Christine Bourda, Metalor
Technologies SAS France; Alexandre Vassa, Metalor
Technologies SAS France; Nourredine Ben Jemaa,
Contelec Company; James Brian Mitchell, University
of Rennes 1
3.3
Passive RFID Tags for Monitoring Electrical
Connection mV Drop
John Shea, Eaton; Jason Carrodus, Eaton; Robert
Spears, Eaton
12:20PM – 1:50PM
LUNCH
ON
OWN
1:50PM – 2:50PM
MODELING
CHAIR: MARJORIE MYERS
CO-CHAIR: GEORGE DREW
4.1
An Analysis of Relationship between Contact
Resistance and Fracture of Oxide Film for
Connector Contacts Using a Finite Element
Method
Takaya Kondo, Yazaki Parts CO., LTD; Hirohito
Nakata, Yazaki Parts CO., LTD; Junya Sekikawa,
Shizuoka University; Yoshihiro Kubota Kubota,
Shizuoka University; Kunio Hayakawa, Shizuoka
University; Tamotsu Nakamura, Shizuoka University
4.2
A Comparison of the Predictions of a Multiscale
Model and Optical Real Area of Contact
Measurements
Robert L. Jackson, Auburn University; Michael P.
Down, University of Southampton; Hong Liu,
University of Southampton Malaysia Campus; John
W. McBride, University of Southampton Malaysia
Campus
4.3
Application of Computational Fluid Dynamics to
Predict the Temperature-Rise of Low Voltage
Switchgear Compartment
Jianyu Qu, Xi'an Jiaotong University; Feng Chong,
Xi'an Jiaotong University; Gang Wu, Xi'an Jiaotong
University; Xingwen Li, Xi'an Jiaotong University;
Qian Wang, Xi'an University of Technology
16
2:50PM – 3:05PM
BREAK
3:05PM – 4:05PM
SLIDING CONTACTS
CHAIR: PETER HALE
CO-CHAIR: HENRY CZAJKOWSKI
5.1
Contact Surfaces for Sliding Electrical Contacts
Christian Holzapfel, Schleifring und Apparatebau
GmbH
5.2
Mechanically-Induced Degradation of Metallic
Sliding Electrical Contacts in Silicone Fluid at
Room Temperature
Michael Dugger, Sandia National Laboratories;
David Groysman, Sandia National Laboratories;
Mathias C. Celina, Sandia National Laboratories;
Todd M. Alam, Sandia; Nicolas Argibay, Sandia
National Laboratories; Brendan L. Nation, Sandia
National Laboratories; Somuri V. Prasad, Sandia
National Laboratories
5.3
Effect of Lubricant on Sliding Conditions in Auplated Slip-ring System for Small Electric Power
Transfer
Koichiro Sawa, Nippon Institute of Technology;
Yoshitada Watanabe, Nippon Institute of Technology;
Takahiro Veno, Nippon Institute of Technology
4:05PM – 4:20PM
BREAK
4:20PM – 5:20PM
CONTACT MATERIALS I
CHAIR: ROLAND TIMSIT
CO-CHAIR: BRETT RICKETT
6.1
Evaluation of Corrosion Films on Cu and Ag
Reactive Monitors Deployed in Data Center
Server Environments
Anil Kurella, Intel Corporation; Balu Pathangey, Intel
Corporation; Karumbu Meyyappan, Intel
Corporation; Ravindra Pukale, Intel Corporation;
Andrew Proctor, Intel Corporation
17
6.2
Electrical Characterization of Graphene Like
Films at Microscopic and Macroscopic Scale
Kevin Dalla Francesca, Sophie Noel, Aymeric
Vecchiola, F. HouzГ©, P. Chretien, D. Alamarguy and
A. JaffrГ© - Supelec-LGEP, UPMC and Paris-Sud
Universities
6.3
Contact Resistance Evaluation of Micro-Contacts
with Upper Hemisphere and Lower Planar or
Engineered Surfaces
Christopher Stilson, Air Force Institue of Technology;
Tod Laurvick, Air Force Institute of Technology;
Ronald Coutu, Air Force Institute of Technology
6:00PM
SOCIAL EVENT
18
TUESDAY, 14 OCTOBER 2014
8:00AM – 9:40AM
ARCING CONTACTS II
CHAIR: JOHN SHEA
CO-CHAIR: GARY HAUPT
7.1
Three-dimensional Observation and Comparison
of Damage Shapes on Ag and AgSnO2 Contact
Surfaces Caused by Break Operations in DC
Inductive Load Currents
Makoto Hasegawa, Chitose Institute of Science and
Technology; Daichi Kawamura, Chitose Institute of
Science and Technology
7.2
Research on an Intelligent Operating Mechanism
of High Voltage Circuit Breaker
Yulong Huang, Tsinghua University; Wijie Wen,
Tsinghua University; Cheng Lin, Tsinghua University;
Guangyao Jin, Pinggao Group Co., Ltd.; Liucheng
Hao, Pinggao Group Co., Ltd.; Gangling Tian,
Pinggao Group Co., Ltd.; Jianying Zhong, Pinggao
Group Co., Ltd.
7.3
Fundamental Characteristics of Arc Extinction by
Magnetic Blow-out at DC Voltages (<500V )
Koichiro Sawa, Nippon Electric Control Equipment
Industries Association (NECA); Masatoshi Tsuruoka,
Nippon Electric Control Equipment Industries
Association (NECA); Makito Morii, Nippon Electric
Control Equipment Industries Association (NECA)
7.4
The Effect of Electrode Temperature and Heat
Capacity on the Electrical Erosion and Material
Transfer for DC Switching of Electrical Contacts
Gerald Witter, Electrical Contacts Plus LLC; Z.K.
Chen, Electrical Contacts Plus LLC; Chris Anderson,
Electrical Contacts Plus LLC
7.5
Arc Analysis to the CID of Li-ion Battery Cells in
High-Current Applications
Amaury Augeard, SAFT, France; Tchapo Singo,
SAFT, France; Philippe Desprez, SAFT; Frederic
Perisse, Clermont UniversitГ©; SГ©bastien Menecier,
Clermont UniversitГ©; M'hammed Abbaoui, Clermont
UniversitГ©
9:40AM – 9:55AM
BREAK
19
9:55AM – 10:55AM
MORTON ANTLER LECTURE
“SO...WHAT’S ALL THIS WIRELESS POWER TRANSFER
STUFF ABOUT ANYWAY??”
JOHN YURTIN, DELPHI
INTRODUCTION BY GERALD WITTER
10:55AM – 11:10AM
BREAK
11:10AM – 12:10PM
POSTER SESSION
CHAIR: GEORGE FLOWERS
CO-CHAIR: BRETT RICKETT
8.1
Effects of Electrodeposited Matte Tin Crystal
Orientation and Grain Structure on Tin Whisker
Growth Propensity Using Stress-Inducing Test
Methods
Rob Schetty, Technic Inc.
8.2
A Comparison of Contact Erosion for Two Types
Arcing Contact of SF6 Circuit Breakers in Making
Process
Can Ding, Huazhong University of Science &
Technology; Junjia He, Huazhong University of Science
& Technology; Xichao Yuan, Huazhong University of
Science & Technology; Zhao Yuan, Huazhong
University of Science & Technology; Yuan Pan,
Huazhong University of Science & Technology
8.3
Mechanical Characterization of a Au Coated
Carbon Nanotube Multi-layered Structure
Hong Liu, University of Southampton Malaysia
Campus; Michael P. Down, University of
Southampton; John W. McBride, University of
Southampton Malaysia Campus; Suan Hui Pu,
University of Southampton Malaysia Campus; Liudi
Jiang, University of Southampton
8.4
Melting Phenomena of Electric Contacts During
Current Interruption
Noboru Wakatsuki, Ishinomaki-Senshu University;
Takayuki Kudo Ishinomaki-Senshu University
20
8.5
Influence of the Electrical Resistance and Wire Size
on the Current Carrying Capacity of Connectors
Michael Blauth, Ostwestfalen-Lippe University of
Applied Sciences; Frank Berger, Ilmenau University
of Technology; Jian Song, Ostwestfalen-Lippe
University of Applied Sciences
8.6
Vibration Induced at Contact Point of a Tighten Up
Connector System
Julien LabbГ©, UniversitГ© de Rennes 1; Rochdi El
Aabdi. UniversitГ© de Rennes 1; Florence Le Strat,
Renault; Erwann Carvou, UniversitГ© de Rennes 1;
CГ©cile Plouzeau, Renault
8.7
Control Program of AC Contactor Based on
Energy Control
Lin Shuyi, Fuzhou University; Xu Zhihong, Fuzhou
University
8.8
Energy Analysis of the Closing Process of an AC
Contactor
Xu Zhihong, Fuzhou University; Lin Shuyi, Fuzhou
University
8.9
Constriction Resistance of Physical Simulated
Electrical Contacts with Nanofabrication
Yasuhiro Fukuyama, National Institute of Advanced
Industrial Science and Technology; Norihiko
Sakamoto, National Institute of Advanced Industrial
Science and Technology; Nobu-hisa Kaneko,
National Institute of Advanced Industrial Science and
Technology; Takaya Kondo, Yazaki Parts CO., LTD;
Masanori Onuma, Yazaki Parts CO., LTD
8.10
A Comparative Study of Arc Erosion at
Frequencies Ranging 50-1000 Hz
Stanislaw Kharin, Kazakh-British Technical
University; Hassan Nouri, University of the West of
England, Bristol; Bogdan Miedzinsky, Wroclaw
University of Technology
12:10PM – 1:30PM
AWARDS LUNCHEON
21
1:30PM – 3:10PM
CONTACT MATERIALS II
CHAIR: ROD MARTENS
CO-CHAIR: SOPHIE NOEL
9.1
Degradation of Contact Materials - Effects of
Time, Temperature and Wear Jian Song, OWL University of Applied Sciences;
Eugen Silbernagel, OWL University of Applied
Sciences; Liangliang Wang, OWL University of
Applied Sciences
9.2
Investigations on Stationary Electrical Joints with
a Bare and a Silver or Nickel Coated Contact
Partner Regarding the Permissible Temperature
Limit According to ANSI IEEE and IEC
Torsten Fuhrmann, Technische Universität Dresden;
Stephan Schlegel, Technische Universität Dresden;
Steffen Großmann, Technische Universität Dresden;
Markus Hoidis, ABB Corporate Research
9.3
Performance Testing and Evaluation of a Ag-W
Nano-Crystalline Silver Alloy as a Gold
Replacement in Electrical Connectors
Trevor Goodrich, Xtalic Corporation; Kathy Bui, Xtalic
Corporation; Andreas Athans , Xtalic Corporation;
Matthew C. Osborne, Amphenol TCS; Phil Stokoe,
Amphenol TCS; John Cahalen, Xtalic Corporation
9.4
Relationship between Electrical-Tribological
Behavior and Properties of Sliding Surfaces of
Copper Containing Diamond-like Carbon
Nanocomposite Coated Plate and Brass Ball
Ryoichi Hombo, Denso Corporation; Naoki Kato,
Denso Corporation; Takahiro Nozu, Denso
Corporation; Naruhiko Inayoshi, Denso Corporation;
Takanori Takeno, Tohoku University; Julien Fontaine,
Г‰cole Centrale de Lyon; Michel Belin, Г‰cole Centrale
de Lyon; Hiroyuki Miki, Tohoku University; Toshiuki
Takagi, Tohoku University
9.5
Influence of Nickel Content on Various
Characteristics of AgNi Contacts for
Electromagnetic Contactors
Kiyoshi Yoshida, Nippon Institute of Technology;
Koichiro Sawa, Nippon Institute of Technology; Kenji
Suzuki, Fuji Electric FA Components & Systems Co.,
Ltd.; Koetsu Takaya, Fuji Electric FA Components &
Systems Co., Ltd.
22
3:10PM – 3:25PM
BREAK
3:25PM – 5:05PM
FRETTING
CHAIR: ROBERT MALUCCI
CO-CHAIR: Z.K. CHEN
10.1
Degradation Phenomenon of Electrical Contacts
by Using a Micro-Sliding Mechanism - The
Comparison with Input Waveforms Concerning
Minimal Sliding Amplitudes Under Some
Conditions
Shin-ichi Wada, TMC System Co. Ltd.; Koichiro
Sawa, Nippon Institute of Thechnology
10.2
Fretting Corrosion in Electric Connectors
Induced by Axial Vibration
Fuxi Zhang , Auburn University; George T. Flowers,
Auburn University
10.3
Fretting Analysis of Tin-coated Terminals Under
Rotational Motion
Keiji Mashimo, Furukawa Electric Co., Ltd.; Yasuyuki
Ishimaru, FITEC Corp.; Hiroyasu Nishikubo, FITEC
Corp.; Yoshikazu Okuno, Furukawa Electric Co., Ltd.;
Shingo Kawata, Furukawa Electric Co., Ltd.
10.4
Influence of Vibration on Connector Sliding Mode
and Amplitude
Keiji Mashimo, Furukawa Electric Co., Ltd.; Hiroyuki
Katayama, FITEC Corp.; Hiroyasu Nishikubo, FITEC
Corp.; Yasuyuki Ishimaru, FITEC Corp.
10.5
Fretting Corrosion in Power Contacts: Electrical
and Thermal Analysis
Sofiane El Mossouess, Physics Institute of Rennes/
Valeo Company; Erwann Carvou, Physics Institute of
Rennes; Rochdi El Abdi, Physics Institute of Rennes;
Nourredine Ben Jemaa, Contelec Company; Laurent
Doublet, Valeo Company; L. Benmamas, Physics
Institute of Rennes
5:05PM
TC1 MEETING
23
WEDNESDAY, 15 OCTOBER 2014
8:00AM – 9:20AM
APPLICATIONS
CHAIR: JOHN MCBRIDE
CO-CHAIR: GEORGE DREW
11.1
Silver Tungsten Carbide Contacts for Circuit
Breaker Applications
Timo MГјtzel, Umicore AG & Co. KG; Bernd Kempf,
Umicore AG
11.2
High Power Hybrid Contactor for Electrical Test
Application
Rajesh Kumar Panda, Larsen and Toubro; Jitendar
Veeramalla, Larsen and Toubro
11.3
A Fault Diagnosis Method of Communication
Connectors in Wireless Receiver Front-end
Circuits
Rui Ji, Beijing University of Posts and
Telecommunications; Jinchun Gao, Beijing University
of Posts and Telecommunications; Gang Xie, Beijing
University of Posts and Telecommunications;
George Flowers, Auburn University; Chen Chen,
Schlumberger
11.4
Electric Vehicle Conductive Charge Couplers
Paul Reid, Schneider Electric; Chad Mittelstadt,
Schneider Electric; Tim Faber, Schneider Electric
9:20AM – 9:35AM
BREAK
9:35AM – 10:35AM
ARCING CONTACTS III
CHAIR: PAUL SLADE
CO-CHAIR: TIMO MГњTZEL
12.1
Comparison of Experimental Results About the
Influence of Gassing Walls of Different Plastic
Compounds on Arcs Confined Both in Tubes and
in MCBs
Diego Gonzalez, TU Ilmenau; Frank Berger, TU
Illmenau; Frank Gerdinand, E-T-A Elektrotechnische
Apparate GmbH; Stefan Holbe, E-T-A
Elektrotechnische Apparate GmbH; Peter Meckler, ET-A Elektrotechnische Apparate GmbH
24
12.2
Simulation of Relay Contact Bouncing Including
a Short Arc Model
Roman Haase, TU Illmenau; Frank Berger, TU Ilmenau
12.3
Experimental Study on Arc Behaviors of a
Bridge-type Contact When Opening a Resistive
Load in the Range of from 280VDC to 730 VDC
Xue Zhou, Harbin Institute of Technology; Xinglei
Cui, Harbin Institute of Technology; Mo Chen, Harbin
Institute of Technology; Guofu Zhai, Harbin Institute
of Technology
10:35AM – 10:50AM
BREAK
10:50AM – 11:50AM
SWITCHES AND RELAYS
CHAIR: KOICHIRO SAWA
CO-CHAIR: XIN ZHOU
13.1
A Practical Study on Electrical Contact
Resistance and Temperature Rise at the
Connections of the Copper Busbars in
Wwitchgears
Sung Won Park, Hyundai Heavy Industries Co. Ltd.;
Hyunsu Cho, Hyundai Heavy Industries Co. Ltd.
13.2
Structure Classification of Electromagnetic
Relays and Comparison of Typical Magnetic
System Containing Permanent Magnet
Huimin Liang, Harbin Institute of Technology; Jiaxin
You, Harbin Institute of Technology; Xie Yong, G&A
Technologies Co., Ltd.; Guangcheng Ma, Harbin
Institute of Technology, China; Guofu Zhai, Harbin
Institute of Technology
13.3
Experimental Research on Direct Current
Switchgear
Hendrik Köpf, University of Technology
Braunschweig; Ernst-Dieter Wilkening, University of
Technology Braunschweig; Christoph Klosinski,
University of Technology Braunschweig; Michael
Kurrat, University of Technology Braunschweig
11:50AM – 1:00PM
LUNCH
ON
OWN
25
1:00PM – 2:00PM
CONNECTOR SYSTEMS
CHAIR: BRETT RICKETT
CO-CHAIR: FRANK RUFFINO
14.1
Mass Parametric Acquisition of Relay Contact
Data During High-Speed Life Test
Brian Frost, Applied Relay Testing Ltd.
14.2
Optimizing Gold Thickness of Land Grid Array
Pads for Cost, Performance and Reliability of
Connectors
Karumbu Meyyappan, Intel Corporation; Alan
McAllister, Intel Corporation; Amit Abraham, Intel
Corporation; Anil Kurella, Intel Corporation; Balu
Pathangey, Intel Corporation; Gregorio Murtagian,
Intel Corporation
14.3
Fundamentals Based Approach to Predict Socket
Stack Performance
Karumbu Meyyappan, Intel Corporation; Alan
McAllister, Intel Corporation; Vijaykumar Krithivasan,
Intel Corporation; Amit Abraham, Intel Corporation;
Gregorio Murtagian, Intel Corporation
2:00PM – 2:15PM
BREAK
2:15PM – 3:35PM
TESTING
CHAIR: RONALD COUTU
CO-CHAIR: RICHARD MOORE
15.1
A Novel Test Rig for In Situ and Real Time
Measurement of Welding Force and Impact Force
of Contacts Within Electromagnetic Relay
Wanbin Ren, Harbin Institute of Technology; Jianbing
Jin, Harbin Institute of Technology; Yinghua Fu, G&A
Technology Co. Ltd; Cheng Chang, Harbin Institute
of Technology
15.2
Accelerated Testing for Electro-Migration
Robert Malucci, RD Malucci Consulting
26
15.3
The Investigation of Electrical Contacts Using
Newly Designed Nano-indentation Manipulator in
Scanning Electron Microscope
Tetsuo Shimizu, National Institute of Advanced
Industrial Science and Technology; Tomoyuki Horie,
National Institute of Advanced Industrial Science and
Technology; Norimichi Watanabe, National Institute
of Advanced Industrial Science and Technology; Jun
Miyawaki, National Institute of Advanced Industrial
Science and Technology; Shunjiro Fujii, National
Institute of Advanced Industrial Science and
Technology; Yoshinori Yamagata, Yazaki Corporation;
Takaya Kondo, Yazaki Parts CO., LTD; Masanori
Onuma, Yazaki Parts CO., LTD
15.4
Dominant Factor of Contact Resistance Analyzed
by Conductive-AFM
Ayako Omura, National Institute of Advanced
Industrial Science and Technology; Megumi Fukuta,
National Institute of Advanced Industrial Science and
Technology; Koji Miyake, National Institute of
Advanced Industrial Science and Technology; Takaya
Kondo, Yazaki Parts CO., LTD; Masanori Onuma,
Yazaki Parts CO., LTD
3:35PM – 3:50PM
BREAK
3:50PM – 5:10PM
MICRO CONTACTS
CHAIR: ROBERT JACKSON
CO-CHAIR: GEORGE FLOWERS
16.1
Experimental Investigation of Thin Film
Spreading Resistance in Micro-Contacts
Tod Laurvick, Air Force Institute of Technology;
Ronald Coutu Jr., Air Force Institute of Technology;
Christopher Stilson, Air Force Institute of Technology
16.2
Electroless Silver Plating and In-Situ SEM
Characterization of CNT-Metal Hybrid Contactors
Onnik Yaglioglu, FormFactor Inc.; Rod Martens, Tyco
Electronics, Ben Eldridge, FormFactor Inc.; Treliant
Fang, Consultant
27
16.3
Evolution of Contact Bounces in MEMS Switches
Under Cycling
Alexis Peschot, CEA LETI; Christophe Poulain, CEA
LETI; Clarissa Valadares, CEA LETI; Bruno Reig,
CEA LETI; Nelly Bonifaci. CNRS G2Elab; Olivier
Lesaint, CNRS G2Elab
16.4
Reducing Contact Resistance of Macro-Scale
Separable Electrical Contacts with Single-Layer
Graphene Coatings
Emil Sandoz-Rosado, Columbia University; Yuanda
Gao, Columbia University; Aleksander Navratil,
Columbia University; James Hone, Columbia
University; Elon J. Terrell, Columbia University;
Rodney Martens, TE Connectivity
5:10PM
CLOSING REMARKS
BRETT RICKETT
28
A u t h o r In d e x
Abbaoui, M'hammed
Abraham, Amit
Alam, Todd M.
Alamarguy, D.
Anderson, Chris
Argibay, Nicolas
Athans, Andreas
Augeard, Amaury
19
26 (2)
17
18
19
17
22
19
Belin, Michel
22
Ben Jemaa, Nourredine 16, 23
Benmamas, L.
23
Berger, Frank
21, 24, 25
Blauth, Michael
21
Bonifaci, Nelly
28
Bozack, Michael
15
Bui, Kathy
22
Cahalen, John
22
Calvo, Jinmi Gregory Lezama 14
Carrodus, Jason
16
Carvou, Erwann 16, 21, 23
Celina, Mathias C.
17
Chang, Cheng
26
Chen, Chen
24
Chen, Mo
25
Chen, Z.K.
19
Cho, Hyunsu
25
Choi, Elsa Yee Kin
16
Chong, Feng
16
Chretien, P.
18
Coutu, Ronald
18
Coutu Jr., Ronald
27
Cui, Xinglei
25
Desprez, Philippe
Ding, Can
Doublet, Laurent
Down, Michael P.
Dugger, Michael
El Aabdi, Rochdi
19
20
23
16, 20
17
21
El Abdi, Rochdi
El Mossouess, Sofiane
Eldridge, Ben
23
23
27
Faber, Tim
Fang, Treliant
Flowers, George
15,
Flowers, George T.
Fontaine, Julien
Francesca, Kevin Dalla
Freudiger, George
Frost, Brian
Fu, Yinghua
Fuhrmann, Torsten
Fujii, Shunjiro
Fukuta, Megumi
Fukuyama, Yasuhiro
24
27
24
23
22
18
15
26
26
22
27
27
21
Gao, Jinchun
Gao, Yuanda
Gatzsche, Michael
Gerdinand, Frank
Ghaednia, Hamed
Gonzalez, Diego
Goodrich, Trevor
GroГџmann, Steffen
Groysman, David
15, 24
28
15
24
15
24
22
15, 22
17
Haase, Roman
Hagen, Benjamin
Hao, Liucheng
Hardy, Sebastien
Hasegawa, Makoto
Hayakawa, Kunio
He, Junjia
Hofmann, Wilfried
Hoidis, Markus
Holbe, Stefan
Holzapfel, Christian
Hombo, Ryoichi
Hone, James
Horie, Tomoyuki
25
15
19
14
14, 19
16
20
15
22
24
17
22
28
27
29
A u t h o r In d e x
Houenouvo, Hermann
HouzГ©, F.
Huang, Yulong
15
18
19
Inayoshi, Naruhiko
Ishimaru, Yasuyuki
22
23 (2)
Jackson, Robert L.
JaffrГ©, A.
Ji, Rui
Jiang, Liudi
Jin, Guangyao
Jin, Jianbing
Joyeux, Patrice
15,16
18
24
20
19
26
14
Kaneko, Nobu-hisa
21
Katayama, Hiroyuki
23
Kato, Naoki
22
Kawamura, Daichi
19
Kawata, Shingo
23
Kempf, Bernd
24
Kharin, Stanislaw
21
Klosinski, Christoph
25
Kondo, Takaya 16, 21, 27 (2)
Köpf, Hendrik
25
Krithivasan, Vijaykumar 26
Kubota Kubota, Yoshihiro 16
Kudo, Takayuki
20
Kufner, Tom
15
Kurella, Anil
17, 26
Kurrat, Michael
25
LabbГ©, Julien
Lall, Pradeep
Laurvick, Tod
Le Strat, Florence
Lesaint, Olivier
Li, Xingwen
Liang, Huimin
Lin, Cheng
Liu, Hong
LГјcke, Nils
21
15
18, 27
21
28
16
25
19
16, 20
15
Ma, Guangcheng
25
Malucci, Robert
26
Martens, Rod
27
Martens, Rodney
28
Mashimo, Keiji
23 (2)
McAllister, Alan
26 (2)
McBride, John W.
16, 20
Meckler, Peter
24
Menecier, SГ©bastien
19
Meyyappan, Karumbu 17, 26 (2)
Miedzinsky, Bogdan
21
Miki, Hiroyuki
22
Mitchell, James Brian
16
Mittelstadt, Chad
24
Miyake, Koji
27
Miyawaki, Jun
27
Morii, Makito
19
Murtagian, Gregorio 26 (2)
MГјtzel, Timo
24
Nakamura, Tamotsu
Nakata, Hirohito
Nation, Brendan L.
Navratil, Aleksander
Nishikubo, Hiroyasu
Noel, Sophie
Nouri, Hassan
Nozu, Takahiro
16
16
17
28
23 (2)
18
21
22
Ohmae, Yuki
14
Okuno, Yoshikazu
23
Omura, Ayako
27
Onuma, Masanori 21, 27 (2)
Osborne, Matthew C.
22
Qu, Jianyu
16
Pan, Yuan
Panda, Rajesh Kumar
Park, Sung Won
Pathangey, Balu
17,
Perisse, Frederic
20
24
25
26
19
30
A u t h o r In d e x
Peschot, Alexis
Plouzeau, CГ©cile
Poulain, Christophe
Prasad, Somuri V.
Proctor, Andrew
Pu, Suan Hui
Pukale, Ravindra
Reid, Paul
Reig, Bruno
Ren, Wanbin
28
21
28
17
17
20
17
24
28
15, 26
Sakamoto, Norihiko
21
Sandoz-Rosado, Emil
28
Sawa, Koichiro 17, 19, 22, 23
Schetty, Rob
20
Schlegel, Stephan
22
Schweitzer, Patrick
14
Sekikawa, Junya
16
Shang, Shang
15
Shea, John
16
Shimizu, Tetsuo
27
Shuyi, Lin
21 (2)
Silbernagel, Eugen
22
Singo, Tchapo
19
Slade, Paul
14
Snipes, Erica
15
Song, Jian
21, 22
Sonobe, Hiroya
14
Spears, Robert
16
Stilson, Christopher 18, 27
Stokoe, Phil
22
Suzuki, Kenji
22
Takagi, Toshiuki
Takaya, Koetsu
Takeno, Takanori
Terrell, Elon J.
Tian, Gangling
Tisserand, Etienne
Tsuruoka, Masatoshi
22
22
22
28
19
14
19
Valadares, Clarissa
Vassa, Alexandre
Vecchiola, Aymeric
Veeramalla, Jitendar
Veno, Takahiro
28
16
18
24
17
Wada, Shin-ichi
Wakatsuki, Noboru
Wang, Liangliang
Wang, Qian
Wang, Zhaobin
Watanabe, Norimichi
Watanabe, Yoshitada
Weber, Serge
Wen, Wijie
Wilkening, Ernst-Dieter
Wintz, Jean-Luc
Witter, Gerald
Wu, Gang
23
20
22
16
15
27
17
14
19
25
14
19
16
Xie, Gang
24
Yaglioglu, Onnik
Yamagata, Yoshinori
Yong, Xie
Yoshida, Kiyoshi
You, Jiaxin
Yuan, Xichao
Yuan, Zhao
27
27
25
22
25
20
20
Zhai, Guofu
Zhang, Fuxi
Zhihong, Xu
Zhong, Jianying
Zhou, Xue
31
15, 25 (2)
23
21 (2)
19
25
32
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