Solder paste, also known as solder cream is used to connect leads on surface mounted integrated circuit chips to the attachment points on the printed circuit boards, which are commonly used in all electronic devices. It is generally applied as a paste through stencil or dispensing tubes on the leads on printed circuit boards, followed by heating the paste in order for it to melt and fuse the connection. Soldering paste is an extremely important ingredient in the electronic circuit manufacturing industry. By physical appearance, it is a gray and putty like material. Solder pastes are of different compositions depending upon their end use requirements. Some of the common solder pastes are tin – lead alloy, tin – silver – copper alloy, tin – silver – copper alloy and tin – antimony alloy.
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